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Volume 131, Issue 3

September 2009

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Research Papers
Technical Briefs

Research Papers

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Fei Qin, Tong An, Na Chen, Jie Bai

J. Electron. Packag. September 2009, 131(3): 031001. doi: https://doi.org/10.1115/1.3144151

Abstract

View articletitled, Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

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Topics: Fractography , Lead-free solders , Solders , Tensile strength , Reliability , Electronic products , Solder joints , Stress-strain curves

Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

S. Abdullah, M. F. Abdullah, A. K. Ariffin, A. Jalar

J. Electron. Packag. September 2009, 131(3): 031002. doi: https://doi.org/10.1115/1.3144155

Abstract

View articletitled, Effect of Leadframe Oxidation on the Reliability of a Quad Flat No-Lead Package

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Topics: Delamination , Fracture (Materials) , Oxidation , Reliability , Shear (Mechanics) , Statistical analysis , Copper , Stress

In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

Ben-Je Lwo, Jeng-Shian Su, Hsien Chung

J. Electron. Packag. September 2009, 131(3): 031003. doi: https://doi.org/10.1115/1.3144149

Abstract

View articletitled, In Situ Chip Stress Extractions for LFBGA Packages Through Piezoresistive Sensors

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Topics: Sensors , Simulation , Stress , Temperature , Packaging , Finite element analysis , Temperature sensors

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

V. Egan, P. A. Walsh, E. Walsh, R. Grimes

J. Electron. Packag. September 2009, 131(3): 031004. doi: https://doi.org/10.1115/1.3144150

Abstract

View articletitled, Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

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Topics: Design , Flow (Dynamics) , Heat sinks , Cooling , Thermal resistance , Fans , Fins

Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

Satoru Katsurayama, Hironori Tohmyoh

J. Electron. Packag. September 2009, 131(3): 031005. doi: https://doi.org/10.1115/1.3144153

Abstract

View articletitled, Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability

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Topics: Flip-chip packages , Hardening (Curing) , Manufacturing , Reliability , Temperature , Warping , Flow (Dynamics) , Flip-chip devices

Laser-Based Target Preparation in 3D Integrated Electronic Packages

Stefan Martens, Walter Mack, Frédéric Courtade, Philippe Perdu, Juergen Wilde, Friedemann Voelklein

J. Electron. Packag. September 2009, 131(3): 031006. doi: https://doi.org/10.1115/1.3144157

Abstract

View articletitled, Laser-Based Target Preparation in 3D Integrated Electronic Packages

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Topics: Lasers , Silicon

Squeezing Flow of a Power Law Fluid Between Grooved Plates

Drew A. Davidson, Bahgat G. Sammakia

J. Electron. Packag. September 2009, 131(3): 031007. doi: https://doi.org/10.1115/1.3144158

Abstract

View articletitled, Squeezing Flow of a Power Law Fluid Between Grooved Plates

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Topics: Flow (Dynamics) , Fluids , Microchannels , Plates (structures) , Flat plates

Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks

Jaeseon Lee, Issam Mudawar

J. Electron. Packag. September 2009, 131(3): 031008. doi: https://doi.org/10.1115/1.3144146

Abstract

View articletitled, Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks

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Topics: Boiling , Flow (Dynamics) , Heat sinks , Microchannels , Pressure drop , Subcooling , Temperature , Two-phase flow

Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

Pablo D. Quinones, Lawrence S. Mok

J. Electron. Packag. September 2009, 131(3): 031009. doi: https://doi.org/10.1115/1.3153407

Abstract

View articletitled, Multiple Fan-Heat Sink Cooling System With Enhanced Evaporator Base: Design, Modeling, and Experiment

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Topics: Copper , Heat , Heat pipes , Heat sinks , Thermal conductivity , Thermal resistance , Cooling , Modeling , Flow (Dynamics) , Finite element analysis

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

B. Xie, X. J. Fan, X. Q. Shi, H. Ding

J. Electron. Packag. September 2009, 131(3): 031010. doi: https://doi.org/10.1115/1.3144147

Abstract

View articletitled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part I: Theory and Numerical Implementation

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Topics: Diffusion (Physics) , Modeling , Temperature , Vapor pressure , Electronic packages

Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

B. Xie, X. J. Fan, X. Q. Shi, H. Ding

J. Electron. Packag. September 2009, 131(3): 031011. doi: https://doi.org/10.1115/1.3144154

Abstract

View articletitled, Direct Concentration Approach of Moisture Diffusion and Whole-Field Vapor Pressure Modeling for Reflow Process—Part II: Application to 3D Ultrathin Stacked-Die Chip Scale Packages

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Topics: Diffusion (Physics) , Vapor pressure , Failure , Modeling

Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

Giulio Lorenzini, Simone Moretti

J. Electron. Packag. September 2009, 131(3): 031012. doi: https://doi.org/10.1115/1.3144152

Abstract

View articletitled, Numerical Performance Analysis of Constructal I and Y Finned Heat Exchanging Modules

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Topics: Fins , Heat , Heat exchangers , Pressure , Shapes , Temperature , Thermal conductivity , Ducts , Reynolds number , Optimization

An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer

Lung-Tai Chen, Wood-Hi Cheng

J. Electron. Packag. September 2009, 131(3): 031013. doi: https://doi.org/10.1115/1.3144156

Abstract

View articletitled, An Overmolded Pressure Sensor Package Using an Ultrathick Photoresist Sacrificial Layer

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Topics: Photoresists , Pressure sensors , Packaging , Membranes , Finite element model

Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

Sangil Lee, M. J. Yim, Daniel Baldwin

J. Electron. Packag. September 2009, 131(3): 031014. doi: https://doi.org/10.1115/1.3153369

Abstract

View articletitled, Void Formation Mechanism of Flip Chip in Package Using No-Flow Underfill

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Topics: Flip-chip devices , Flow (Dynamics) , Solders , Hardening (Curing) , Chemical reactions , Wetting , Temperature , Flip-chip , Manufacturing

Technical Briefs

An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

Nihad Dukhan

J. Electron. Packag. September 2009, 131(3): 034501. doi: https://doi.org/10.1115/1.3143947

Abstract

View articletitled, An Engineering Estimate for Plug-Flow Convection in Porous Media Discarding Fluid Conduction

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Topics: Convection , Flow (Dynamics) , Fluids , Heat conduction , Porous materials , Temperature , Graphite , Metal foams , Thermal conductivity

Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

H. A. Mustain, William D. Brown, Simon S. Ang

J. Electron. Packag. September 2009, 131(3): 034502. doi: https://doi.org/10.1115/1.3153582

Abstract

View articletitled, Tungsten Carbide as a Diffusion Barrier on Silicon Nitride Active- Metal-Brazed Substrates for Silicon Carbide Power Devices

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Topics: Copper , Diffusion (Physics) , Silicon , Silicon nitride ceramics , Tungsten , Annealing , High temperature , Metals , Temperature , Electron spectroscopy

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