Topics: Design , Optimization , Solder joints , Response surface methodology , Solders , Printed circuit boards , Reliability , Fatigue life , Finite element analysis , Experimental design

An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process

Zone-Ching Lin, Chang-Cheng Chen

J. Electron. Packag. March 2007, 129(1): 19–27. doi: https://doi.org/10.1115/1.2429705

Abstract

View articletitled, An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process

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Topics: Molding , Stress , Temperature

Shorter Field Life in Power Cycling for Organic Packages

S. B. Park, Izhar Z. Ahmed

J. Electron. Packag. March 2007, 129(1): 28–34. doi: https://doi.org/10.1115/1.2429706

Abstract

View articletitled, Shorter Field Life in Power Cycling for Organic Packages

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Topics: Computational fluid dynamics , Finite element analysis , Flip-chip devices , Manufacturing , Reliability , Solders , Temperature , Ball-Grid-Array packaging , Structural analysis , Cycles

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

Hai Bo Fan, Edward K. L. Chan, Cell K. Y. Wong, Matthew M. F. Yuen

J. Electron. Packag. March 2007, 129(1): 35–40. doi: https://doi.org/10.1115/1.2429707

Abstract

View articletitled, Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

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Topics: Adhesion , Electronic packaging , Molecular dynamics simulation , Reliability , Epoxy resins , Simulation , Cycles , Copper , Molecular dynamics

Constitutive Modeling on Time-Dependent Deformation Behavior of $96.5 Sn - 3.5 Ag$ Solder Alloy Under Cyclic Multiaxial Straining

Xianjie Yang, Yan Luo, Qing Gao

J. Electron. Packag. March 2007, 129(1): 41–47. doi: https://doi.org/10.1115/1.2429708

Abstract

View articletitled, Constitutive Modeling on Time-Dependent Deformation Behavior of <math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><mn>96.5</mn><mi>Sn</mi><mo>-</mo><mn>3.5</mn><mi>Ag</mi></mrow></math> Solder Alloy Under Cyclic Multiaxial Straining

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Topics: Deformation , Modeling , Solders , Stress , Alloys , Tin , Constitutive equations

Effect of Test Conditions on Electromigration Reliability of $Sn - Ag - Cu$ Flip-Chip Solder Interconnects

Yi-Shao Lai, Chiu-Wen Lee, Chin-Li Kao

J. Electron. Packag. March 2007, 129(1): 56–62. doi: https://doi.org/10.1115/1.2429710

Abstract

View articletitled, Effect of Test Conditions on Electromigration Reliability of <math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><mi>Sn</mi><mo>-</mo><mi>Ag</mi><mo>-</mo><mi>Cu</mi></mrow></math> Flip-Chip Solder Interconnects

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Topics: Electrodiffusion , Flip-chip , Reliability , Solders , Tin , Current density , Temperature , Temperature distribution

Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface

X. J. Wei, Y. K. Joshi, P. M. Ligrani

J. Electron. Packag. March 2007, 129(1): 63–70. doi: https://doi.org/10.1115/1.2429711

Abstract

View articletitled, Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface

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Topics: Flow (Dynamics) , Heat transfer , Laminar flow , Microchannels , Microscale devices , Computer simulation

A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls

Tadahiro Shibutani, Qiang Yu, Masaki Shiratori

J. Electron. Packag. March 2007, 129(1): 71–75. doi: https://doi.org/10.1115/1.2429712

Abstract

View articletitled, A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls

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Topics: Creep , Nanoindentation , Solders , Stress , Deformation , Diffusion (Physics)

The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks

J. Richard Culham, Waqar A. Khan, M. Michael Yovanovich, Yuri S. Muzychka

J. Electron. Packag. March 2007, 129(1): 76–81. doi: https://doi.org/10.1115/1.2429713

Abstract

View articletitled, The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks

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Topics: Design , Heat sinks , Thermal conductivity , Optimization

Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of $Sn ∕ 37 Pb$ and $Sn ∕ 3 Ag ∕ 0.5 Cu$ Solder Alloys

Katsuhiko Sasaki, Takuji Kobayashi, Ken-ichi Ohguchi

J. Electron. Packag. March 2007, 129(1): 82–89. doi: https://doi.org/10.1115/1.2429714

Abstract

View articletitled, Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of <math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><mi>Sn</mi><mo>∕</mo><mn>37</mn><mi>Pb</mi></mrow></math> and <math xmlns="http://www.w3.org/1998/Math/MathML"><mrow xmlns=""><mi>Sn</mi><mo>∕</mo><mn>3</mn><mi>Ag</mi><mo>∕</mo><mn>0.5</mn><mi>Cu</mi></mrow></math> Solder Alloys

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Topics: Alloys , Creep , Deformation , Lead-free solders , Solders , Stress

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Tohru Suwa, Hamid Hadim

J. Electron. Packag. March 2007, 129(1): 90–97. doi: https://doi.org/10.1115/1.2429715

Abstract

View articletitled, Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

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Topics: Genetic algorithms , Heat , Junctions , Optimization , Temperature , Electrical wires , Density , Artificial neural networks , Electronic components

Design Guideline for Ball Impact Test Apparatus

Chang-Lin Yeh, Yi-Shao Lai

J. Electron. Packag. March 2007, 129(1): 98–104. doi: https://doi.org/10.1115/1.2429716

Abstract

View articletitled, Design Guideline for Ball Impact Test Apparatus

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Topics: Brittleness , Design , Fracture (Process) , Impact testing , Reliability , Solder joints , Transients (Dynamics) , Damping , Structural dynamics

Research Papers

Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects

Chao-Ming Lin, Win-Jin Chang, Te-Hua Fang

J. Electron. Packag. March 2007, 129(1): 48–55. doi: https://doi.org/10.1115/1.2429709

Abstract

View articletitled, Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects

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Topics: Flip-chip , Flow (Dynamics) , Inertia (Mechanics) , Packaging , Pressure , Rotation , Surface tension

Technical Brief

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Yi-Shao Lai, Chang-Lin Yeh, Ching-Chun Wang

J. Electron. Packag. March 2007, 129(1): 105–108. doi: https://doi.org/10.1115/1.2429717

Abstract

View articletitled, Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

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Topics: Reliability , Semiconductor wafers , Solder joints , Transient analysis

Book Reviews

Lead-Free Implementation and Production–A Manufacturing Guide

Anthony J. Rafanelli

J. Electron. Packag. March 2007, 129(1): 109–110. doi: https://doi.org/10.1115/1.2429719

Extract

View articletitled, Lead-Free Implementation and Production–A Manufacturing Guide

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Topics: Manufacturing , Solders

Electrical Properties of Polymers

Anthony J. Rafanelli

J. Electron. Packag. March 2007, 129(1): 111. doi: https://doi.org/10.1115/1.2429720

Extract

View articletitled, Electrical Properties of Polymers

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Topics: Electrical properties , Polymers

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Research Papers

Assessment of Some Integrated Cooling Mechanisms for an Active Integrated Power Electronics Module

Design Optimization and Reliability of PWB Level Electronic Package

An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process

Shorter Field Life in Power Cycling for Organic Packages

Molecular Dynamics Simulation of Thermal Cycling Test in Electronic Packaging

Constitutive Modeling on Time-Dependent Deformation Behavior of $96.5 Sn - 3.5 Ag$ Solder Alloy Under Cyclic Multiaxial Straining

Effect of Test Conditions on Electromigration Reliability of $Sn - Ag - Cu$ Flip-Chip Solder Interconnects

Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface

A Study of Deformation Mechanism During Nanoindentation Creep in Tin-Based Solder Balls

The Influence of Material Properties and Spreading Resistance in the Thermal Design of Plate Fin Heat Sinks

Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of $Sn ∕ 37 Pb$ and $Sn ∕ 3 Ag ∕ 0.5 Cu$ Solder Alloys

Multidisciplinary Placement Optimization of Heat Generating Electronic Components on Printed Circuit Boards

Design Guideline for Ball Impact Test Apparatus

Research Papers

Flip-Chip Underfill Packaging Considering Capillary Force, Pressure Difference, and Inertia Effects

Technical Brief

Investigations of Board-Level Drop Reliability of Wafer-Level Chip-Scale Packages

Book Reviews

Lead-Free Implementation and Production–A Manufacturing Guide

Electrical Properties of Polymers

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