Volume 127 Issue 3 | J. Electron. Packag.

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Volume 127, Issue 3

September 2005

ISSN 1043-7398

EISSN 1528-9044

Research Papers

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

H. Bhowmik, K. W. Tou

J. Electron. Packag. September 2005, 127(3): 193–199. doi: https://doi.org/10.1115/1.1997155

Abstract

View articletitled, An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

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Topics: Flow (Dynamics) , Forced convection , Heat , Heat transfer , Laminar flow , Pumps , Temperature , Transient heat transfer , Transients (Dynamics) , Water

Dynamics Of Board-Level Drop Impact

E. H. Wong

J. Electron. Packag. September 2005, 127(3): 200–207. doi: https://doi.org/10.1115/1.1938987

Abstract

View articletitled, Dynamics Of Board-Level Drop Impact

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Topics: Corners (Structural elements) , Deflection , Dynamics (Mechanics) , Finite element analysis , Springs , Stress , Electronic packaging , Impact testing

A Damage-Mechanics-Based Constitutive Model for Solder Joints

C. Basaran, Y. Zhao, H. Tang, J. Gomez

J. Electron. Packag. September 2005, 127(3): 208–214. doi: https://doi.org/10.1115/1.1939822

Abstract

View articletitled, A Damage-Mechanics-Based Constitutive Model for Solder Joints

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Topics: Constitutive equations , Creep , Damage , Flow (Dynamics) , Hardening , Kinematics , Solder joints , Solders , Stress , Temperature

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

H. Bhowmik, C. P. Tso, K. W. Tou

J. Electron. Packag. September 2005, 127(3): 215–222. doi: https://doi.org/10.1115/1.1938207

Abstract

View articletitled, Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

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Topics: Computer simulation , Convection , Flow (Dynamics) , Forced convection , Heat , Water , Heat flux , Fluids , Laminar flow , Reynolds number

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Tzer-Ming Jeng, Li-Kang Liu, Ying-Huei Hung

J. Electron. Packag. September 2005, 127(3): 223–234. doi: https://doi.org/10.1115/1.1997159

Abstract

View articletitled, A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

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Topics: Aluminum , Fluids , Heat sinks , Heat transfer , Liquid crystals , Metal foams , Porosity , Reynolds number , Steady state , Temperature

Effect of Stress on the Dielectric Constant of Alumina

Sihai Wen, D. D. L. Chung

J. Electron. Packag. September 2005, 127(3): 235–236. doi: https://doi.org/10.1115/1.1939029

Abstract

View articletitled, Effect of Stress on the Dielectric Constant of Alumina

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Topics: Stress , Compressive stress

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Tae-Sang Park, Soon-Bok Lee

J. Electron. Packag. September 2005, 127(3): 237–244. doi: https://doi.org/10.1115/1.1871192

Abstract

View articletitled, Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

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Topics: Ball-Grid-Array packaging , Displacement , Fatigue life , Fatigue testing , Low cycle fatigue , Solder joints , Solders , Stress , Testing , Tin

Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection

Valérie Eveloy, Peter Rodgers, M. S. J. Hashmi

J. Electron. Packag. September 2005, 127(3): 245–254. doi: https://doi.org/10.1115/1.1938988

Abstract

View articletitled, Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection

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Topics: Computer simulation , Heat transfer , Junctions , Modeling , Natural convection , Temperature , Computational fluid dynamics , Dimensions , Vehicles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans

J. Electron. Packag. September 2005, 127(3): 255–261. doi: https://doi.org/10.1115/1.1939007

Abstract

View articletitled, Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

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Topics: Continuum mechanics , Deformation , Dislocations , Lumber , Microelectronic devices , Plasticity , Strain gradient , Boundary-value problems , Metals , Stress

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

X. J. Fan, J. Zhou, G. Q. Zhang, L. J. Ernst

J. Electron. Packag. September 2005, 127(3): 262–267. doi: https://doi.org/10.1115/1.1939027

Abstract

View articletitled, A Micromechanics-Based Vapor Pressure Model in Electronic Packages

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Topics: Vapor pressure , Temperature , Micromechanics (Engineering) , Vapors

Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading

Andrew A. O. Tay

J. Electron. Packag. September 2005, 127(3): 268–275. doi: https://doi.org/10.1115/1.1938209

Abstract

View articletitled, Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading

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Topics: Delamination , Fracture (Materials)

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

J. M. J. den Toonder, Y. Ramone, A. R. van Dijken, J. G. J. Beijer, G. Q. Zhang

J. Electron. Packag. September 2005, 127(3): 276–285. doi: https://doi.org/10.1115/1.1938990

Abstract

View articletitled, Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

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Topics: Creep , Finite element analysis , Modeling , Nanoindentation , Stress , Viscoelasticity , Manganese (Metal) , Silicon , Relaxation (Physics) , Displacement

Design of Micro-Temperature Sensor Array With Thin Film Thermocouples

Jong-Jin Park, Minoru Taya

J. Electron. Packag. September 2005, 127(3): 286–289. doi: https://doi.org/10.1115/1.1997157

Abstract

View articletitled, Design of Micro-Temperature Sensor Array With Thin Film Thermocouples

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Topics: Heat conduction , Sensors , Temperature , Thermocouples , Thin films , Copper , Steady state , Heat , Flow (Dynamics) , Finite element analysis

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Mudasir Ahmad, Ken Hubbard, Mason Hu

J. Electron. Packag. September 2005, 127(3): 290–298. doi: https://doi.org/10.1115/1.1938985

Abstract

View articletitled, Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

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Topics: Shapes , Solder joints , Solders , Surface tension , Warping , Finite element analysis , Ball-Grid-Array packaging

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

Ben Ting, Vincent P. Manno

J. Electron. Packag. September 2005, 127(3): 299–305. doi: https://doi.org/10.1115/1.1938206

Abstract

View articletitled, Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

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Topics: Fibers , Lasers , Simulation , Transients (Dynamics) , Temperature , Manufacturing , Thermomechanics , Geometry , Displacement , Materials properties

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Hamid Hadim, Tohru Suwa

J. Electron. Packag. September 2005, 127(3): 306–313. doi: https://doi.org/10.1115/1.1997161

Abstract

View articletitled, A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

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Topics: Artificial neural networks , Design , Optimization , Ball-Grid-Array packaging , Ball-Grid-Array packages , Solders

Interfacial Thermal Stresses in Trilayer Assemblies

H. R. Ghorbani, J. K. Spelt

J. Electron. Packag. September 2005, 127(3): 314–323. doi: https://doi.org/10.1115/1.1938205

Abstract

View articletitled, Interfacial Thermal Stresses in Trilayer Assemblies

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Topics: Shear (Mechanics) , Shear stress , Stress , Manufacturing , Plane strain , Thermal stresses , Finite element analysis

Three-Dimensional Paddle Shift Modeling for IC Packaging

Chien-Chang Pei, Sheng-Jye Hwang

J. Electron. Packag. September 2005, 127(3): 324–334. doi: https://doi.org/10.1115/1.1938986

Abstract

View articletitled, Three-Dimensional Paddle Shift Modeling for IC Packaging

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Topics: Computation , Deflection , Flow (Dynamics) , Fluid dynamics , Geometry , Integrated circuit packaging , Integrated circuits , Mesh generation , Modeling , Molding

Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

Chien-Chang Pei, Sheng-Jye Hwang

J. Electron. Packag. September 2005, 127(3): 335–339. doi: https://doi.org/10.1115/1.1939028

Abstract

View articletitled, Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

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Topics: Density , Wire , Flow (Dynamics)

Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

Srinivasa Aravamudhan, Daryl Santos, Gerald Pham-Van-Diep, Frank Andres

J. Electron. Packag. September 2005, 127(3): 340–352. doi: https://doi.org/10.1115/1.1938208

Abstract

View articletitled, Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

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Topics: Printing , Solders

Technical Briefs

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

Jun Xu, Richard A. Wirtz

J. Electron. Packag. September 2005, 127(3): 353–356. doi: https://doi.org/10.1115/1.1997162

Abstract

View articletitled, In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

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Topics: Diamonds , Laminates , Thermal conductivity , Porosity

Effects of Two-Dimensional Roughness in Flow in Microchannels

Xiang-Qi Wang, Christopher Yap, Arun Sadashiv Mujumdar

J. Electron. Packag. September 2005, 127(3): 357–361. doi: https://doi.org/10.1115/1.1997164

Abstract

View articletitled, Effects of Two-Dimensional Roughness in Flow in Microchannels

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Topics: Poiseuille flow , Surface roughness , Friction , Flow (Dynamics) , Microchannels

Research Papers

An Experimental Study of Transient Heat Transfer From Discrete Heat Sources in Water Cooled Vertical Rectangular Channel

Dynamics Of Board-Level Drop Impact

A Damage-Mechanics-Based Constitutive Model for Solder Joints

Analyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel

A Novel Semi-empirical Model for Evaluating Thermal Performance of Porous Metallic Foam Heat Sinks

Effect of Stress on the Dielectric Constant of Alumina

Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions

Numerical Heat Transfer Predictive Accuracy for an In-Line Array of Board-Mounted Plastic Quad Flat Back Components in Free Convection

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

A Micromechanics-Based Vapor Pressure Model in Electronic Packages

Modeling of Interfacial Delamination in Plastic IC Packages Under Hygrothermal Loading

Viscoelastic Characterization of Low-Dielectric Constant SiLK Films Using Nanoindentation in Combination With Finite Element Modeling

Design of Micro-Temperature Sensor Array With Thin Film Thermocouples

Solder Joint Shape Prediction Using a Modified Perzyna Viscoplastic Model

Transient Thermomechanical Simulation of Laser Hammering in Optoelectronic Package Manufacturing

A Multidisciplinary Design and Optimization Methodology for Ball Grid Array Packages Using Artificial Neural Networks

Interfacial Thermal Stresses in Trilayer Assemblies

Three-Dimensional Paddle Shift Modeling for IC Packaging

Prediction of Wire Sweep During the Encapsulation of IC Packaging With Wire Density Effect

Characterization of the Solder Paste Release From Small Stencil Apertures in the Stencil Printing Process

Technical Briefs

In-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates

Effects of Two-Dimensional Roughness in Flow in Microchannels

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