Volume 125 Issue 3 | J. Electron. Packag.

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Technical Papers

Analysis of Substrates for Single Emitter Laser Diodes

Tapani M. Alander, Pekka A. Heino, Eero O. Ristolainen

J. Electron. Packag. September 2003, 125(3): 313–318. doi: https://doi.org/10.1115/1.1527657

Abstract

View articletitled, Analysis of Substrates for Single Emitter Laser Diodes

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Topics: Lasers , Stress , Bonding , Thermal conductivity , Ceramics , Temperature , Gallium arsenide

Compact Modeling of Forced Flow in Longitudinal Fin Heat Sinks With Tip Bypass

C. B. Coetzer, J. A. Visser

J. Electron. Packag. September 2003, 125(3): 319–324. doi: https://doi.org/10.1115/1.1533803

Abstract

View articletitled, Compact Modeling of Forced Flow in Longitudinal Fin Heat Sinks With Tip Bypass

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Topics: Flow (Dynamics) , Heat sinks , Computational fluid dynamics

Packaging of Optical MEMS Devices

Yee L. Low, Ronald E. Scotti, David A. Ramsey, Cristian A. Bolle, Steven P. O’Neill, Khanh C. Nguyen

J. Electron. Packag. September 2003, 125(3): 325–328. doi: https://doi.org/10.1115/1.1535933

Abstract

View articletitled, Packaging of Optical MEMS Devices

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Topics: Ceramics , Microelectromechanical systems , Packaging , Thin films

Simulation of Void Growth in Molten Solder Bumps

Ronald L. Panton, Fellow ASME, Jong W. Lee, Lakhi Goenka, Achyuta Achari

J. Electron. Packag. September 2003, 125(3): 329–334. doi: https://doi.org/10.1115/1.1569954

Abstract

View articletitled, Simulation of Void Growth in Molten Solder Bumps

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Topics: Bubbles , Melting , Solders , Flow (Dynamics) , Surface tension , Viscosity , Temperature

Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens

A. Tava´rez, J. E. Gonza´lez

J. Electron. Packag. September 2003, 125(3): 335–346. doi: https://doi.org/10.1115/1.1569955

Abstract

View articletitled, Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens

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Topics: Ovens , Solders , Temperature , Weight (Mass) , Modeling , Heat transfer , Heating , Cooling , Temperature profiles , Melting

Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages

Hasan U. Akay, Professor and Chair, Mem. ASME, Yan Liu, Research Assistant, Mostafa Rassaian, Technical Fellow, Mem. ASME,

J. Electron. Packag. September 2003, 125(3): 347–353. doi: https://doi.org/10.1115/1.1569956

Abstract

View articletitled, Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages

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Topics: Fatigue life , Finite element model , Solder joints , Fatigue

Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

Sreekant V. J. Narumanchi, Cristina H. Amon, Fellow ASME, Jayathi Y. Murthy, Mem. ASME

J. Electron. Packag. September 2003, 125(3): 354–361. doi: https://doi.org/10.1115/1.1572903

Abstract

View articletitled, Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

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Topics: Heat transfer , Jets , Temperature , Capacitance , Reynolds number

Local Heat Transfer Characteristics in Simulated Electronic Modules

Seong-Yeon Yoo, Jong-Hark Park, Min-Ho Chung

J. Electron. Packag. September 2003, 125(3): 362–368. doi: https://doi.org/10.1115/1.1602478

Abstract

View articletitled, Local Heat Transfer Characteristics in Simulated Electronic Modules

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Topics: Generators , Heat transfer , Vortices , Flow (Dynamics) , Heat transfer coefficients , Wakes , Forced convection

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

Bingzhi Su, Y. C. Lee, Martin L. Dunn

J. Electron. Packag. September 2003, 125(3): 369–377. doi: https://doi.org/10.1115/1.1602702

Abstract

View articletitled, Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

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Topics: Corners (Structural elements) , Fracture (Materials) , Fracture (Process) , Gallium arsenide , Geometry , Solders , Stress , Brittleness , Temperature , Finite element analysis

A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

Ravi S. Prasher

J. Electron. Packag. September 2003, 125(3): 378–385. doi: https://doi.org/10.1115/1.1602479

Abstract

View articletitled, A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

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Topics: Cooling , Heat , Heat conduction , Heat pipes , Modeling , Temperature , Thermal conductivity , Vapors , Design , Heat sinks

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Ravi S. Prasher, Paul Koning, James Shipley, Amit Devpura

J. Electron. Packag. September 2003, 125(3): 386–391. doi: https://doi.org/10.1115/1.1602703

Abstract

View articletitled, Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

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Topics: Contact resistance , Particulate matter , Thermal conductivity , Percolation theory , Stiffness , Modeling , Polymers , Fillers (Materials)

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

T. Y. Lin, Z. P. Xiong, Y. F. Yao, Lane Tok, Z. Y. Yu, Budi Njoman, K. H. Chua, Y. Y. Ma

J. Electron. Packag. September 2003, 125(3): 392–399. doi: https://doi.org/10.1115/1.1602704

Abstract

View articletitled, Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

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Topics: Delamination , Finite element analysis , Stress concentration , Failure analysis , Adhesion

Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill

Ji Eun Park, Iwona Jasiuk, Aleksander Zubelewicz

J. Electron. Packag. September 2003, 125(3): 400–413. doi: https://doi.org/10.1115/1.1602480

Abstract

View articletitled, Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill

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Topics: Particulate matter , Stress , Fracture (Materials) , Fracture (Process) , Strips

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Hideo Koguchi, Chie Sasaki, Kazuto Nishida

J. Electron. Packag. September 2003, 125(3): 414–419. doi: https://doi.org/10.1115/1.1602705

Abstract

View articletitled, Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

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Topics: Deflection , Temperature , Finite element methods , Plates (structures)

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Takehiro Saitoh, Hidehito Matsuyama, Masayuki Toya

J. Electron. Packag. September 2003, 125(3): 420–425. doi: https://doi.org/10.1115/1.1602706

Abstract

View articletitled, Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

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Topics: Delamination , Fracture (Process) , Resins , Temperature , Copper alloys , Fracture mechanics , Alloys , Radioactive tracers , Wedges , Cracking (Materials)

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Cemal Basaran, Associate Professor, Yujun Wen, Ph.D. Candidate

J. Electron. Packag. September 2003, 125(3): 426–430. doi: https://doi.org/10.1115/1.1602707

Abstract

View articletitled, Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

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Topics: Ball-Grid-Array packaging , Finite element analysis , Modeling , Reliability , Solder joints , Solders , Temperature , Tin , Surface mount technology , Diffusion (Physics)

Pumpless Loop for Narrow Channel and Micro-Channel Boiling

Swaraj Mukherjee, Issam Mudawar

J. Electron. Packag. September 2003, 125(3): 431–441. doi: https://doi.org/10.1115/1.1602708

Abstract

View articletitled, Pumpless Loop for Narrow Channel and Micro-Channel Boiling

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Topics: Boilers , Boiling , Cooling , Critical heat flux , Flow (Dynamics) , Pressure drop , Water , Coolants , Heat , Temperature

Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

Octavio Leon, Gilbert De Mey, Erik Dick, Jan Vierendeels

J. Electron. Packag. September 2003, 125(3): 442–446. doi: https://doi.org/10.1115/1.1602709

Abstract

View articletitled, Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

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Topics: Cooling , Fins , Flow (Dynamics) , Pressure drop , Heat , Heat transfer , Heat sinks , Coolants , Forced convection

Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

K. Ramakrishna, Fellow ASME, J. R. Trent

J. Electron. Packag. September 2003, 125(3): 447–455. doi: https://doi.org/10.1115/1.1602710

Abstract

View articletitled, Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

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Topics: Junctions , Molding , Printed circuit boards , Temperature , Thermal conductivity , Natural convection , Wire , Automotive industry , Emissivity

Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

A. G. Agwu Nnanna, A. Haji-Sheikh ,, ASME Fellow, D. Agonafer,, ASME Fellow

J. Electron. Packag. September 2003, 125(3): 456–460. doi: https://doi.org/10.1115/1.1602711

Abstract

View articletitled, Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

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Topics: Geometry , Heat losses , Heat transfer , Heat transfer coefficients , Temperature distribution , Temperature , Fins

Technical Papers

Analysis of Substrates for Single Emitter Laser Diodes

Compact Modeling of Forced Flow in Longitudinal Fin Heat Sinks With Tip Bypass

Packaging of Optical MEMS Devices

Simulation of Void Growth in Molten Solder Bumps

Modeling the Thermal Behavior of Solder Paste Inside Reflow Ovens

Simplification of Finite Element Models for Thermal Fatigue Life Prediction of PBGA Packages

Influence of Pulsating Submerged Liquid Jets on Chip-Level Thermal Phenomena

Local Heat Transfer Characteristics in Simulated Electronic Modules

Die Cracking at Solder (In60-Pb40) Joints on Brittle (GaAs) Chips: Fracture Correlation Using Critical Bimaterial Interface Corner Stress Intensities

A Simplified Conduction Based Modeling Scheme for Design Sensitivity Study of Thermal Solution Utilizing Heat Pipe and Vapor Chamber Technology

Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

Failure Analysis of Full Delamination on the Stacked Die Leaded Packages

Interfacial Stress Analysis and Fracture of a Bi-Material Strip With a Heterogeneous Underfill

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Delamination and Encapsulant Resin Cracking in LSI Plastic Packages Subjected to Temperature Cyclic Loading

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Pumpless Loop for Narrow Channel and Micro-Channel Boiling

Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

Prediction of Thermal Performance of Wire-Bonded Plastic Ball Grid Array Package for Underhood Automotive Applications

Effect of Variable Heat Transfer Coefficient, Fin Geometry, and Curvature on the Thermal Performance of Extended Surfaces

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