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Issues
March 2003
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Statistical Aspects of Lifetime in the Presence of UV Radiation
J. Electron. Packag. March 2003, 125(1): 1–3.
doi: https://doi.org/10.1115/1.1498263
Topics:
Composite materials
,
Reliability
,
Shapes
,
Stress
,
Ultraviolet radiation
,
Damage
,
Rupture
,
Weibull distribution
,
Microcracks
,
Testing
Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures
J. Electron. Packag. March 2003, 125(1): 4–17.
doi: https://doi.org/10.1115/1.1512295
Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages
J. Electron. Packag. March 2003, 125(1): 18–23.
doi: https://doi.org/10.1115/1.1520430
Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials
J. Electron. Packag. March 2003, 125(1): 24–30.
doi: https://doi.org/10.1115/1.1524132
Topics:
Absorption
,
Diffusion (Physics)
,
Fracture (Materials)
,
Fracture (Process)
,
Resins
,
Fracture toughness
Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
J. Electron. Packag. March 2003, 125(1): 31–38.
doi: https://doi.org/10.1115/1.1525244
Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System
J. Electron. Packag. March 2003, 125(1): 39–43.
doi: https://doi.org/10.1115/1.1525820
Topics:
Errors
,
Flip-chip devices
,
Inspection
,
Signal processing
,
Signals
,
Solder joints
,
Flip-chip
,
Data acquisition
,
Vibration
Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies
J. Electron. Packag. March 2003, 125(1): 44–52.
doi: https://doi.org/10.1115/1.1527656
Topics:
Fracture (Materials)
,
Fracture (Process)
,
Particulate matter
,
Stress
,
Strips
,
Flip-chip assemblies
Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending
J. Electron. Packag. March 2003, 125(1): 53–58.
doi: https://doi.org/10.1115/1.1527892
Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
Haruo Nose, Lecturer,, Masao Sakane, Professor,, Yutaka Tsukada, Researcher, Hideo Nishimura, Researcher
J. Electron. Packag. March 2003, 125(1): 59–66.
doi: https://doi.org/10.1115/1.1533058
Topics:
Solders
,
Temperature
,
Tensile strength
,
Tin
,
Yield stress
,
Young's modulus
,
Creep
,
Stress
An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling
J. Electron. Packag. March 2003, 125(1): 67–75.
doi: https://doi.org/10.1115/1.1533059
An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion
J. Electron. Packag. March 2003, 125(1): 76–83.
doi: https://doi.org/10.1115/1.1533060
Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies
J. Electron. Packag. March 2003, 125(1): 84–92.
doi: https://doi.org/10.1115/1.1533802
Topics:
Finite element analysis
,
Flip-chip assemblies
,
Simulation
,
Solder joints
,
Solders
,
Stress
,
Deformation
,
Cycles
,
Flip-chip packages
,
Thermal expansion
Impact Resistance of SM Joints Formed With ICA
J. Electron. Packag. March 2003, 125(1): 93–97.
doi: https://doi.org/10.1115/1.1534842
Topics:
Adhesives
,
Copper
,
Fracture (Materials)
,
Impact testing
,
Shear (Mechanics)
,
Shear strength
,
Solders
,
Silver
,
Resistors
,
Alloys
Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips
J. Electron. Packag. March 2003, 125(1): 98–103.
doi: https://doi.org/10.1115/1.1535932
Topics:
Design
,
Reliability
,
Stress
,
Electronic packages
,
Corners (Structural elements)
,
Event history analysis
,
Solders
Heat Transfer and Flow Friction Characteristics for Compact Cold Plates
J. Electron. Packag. March 2003, 125(1): 104–113.
doi: https://doi.org/10.1115/1.1536170
Topics:
Flow (Dynamics)
,
Heat transfer
,
Plates (structures)
,
Temperature
,
Thermal resistance
,
Heat flux
,
Pressure drop
,
Friction
,
Heat
,
Reynolds number
The Strength of the Silicon Die in Flip-Chip Assemblies
J. Electron. Packag. March 2003, 125(1): 114–119.
doi: https://doi.org/10.1115/1.1535934
Topics:
Fracture (Materials)
,
Fracture (Process)
,
Probability
,
Reliability
,
Silicon
,
Stress
,
Grinding
,
Flip-chip assemblies
A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints
J. Electron. Packag. March 2003, 125(1): 120–125.
doi: https://doi.org/10.1115/1.1536171
Topics:
Cycles
,
Damage
,
Fatigue life
,
Finite element analysis
,
Simulation
,
Solder joints
,
Solders
,
Constitutive equations
,
Fatigue
,
Ball-Grid-Array packaging
Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging
J. Electron. Packag. March 2003, 125(1): 126–133.
doi: https://doi.org/10.1115/1.1535445
Topics:
Freezing
,
Heat transfer
,
Melting
,
Packaging
,
Solidification
,
Temperature distribution
,
Phase change materials
,
Convection
Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
J. Electron. Packag. March 2003, 125(1): 134–138.
doi: https://doi.org/10.1115/1.1535446
An Efficient Solution for Wire Sweep Analysis in IC Packaging
J. Electron. Packag. March 2003, 125(1): 139–143.
doi: https://doi.org/10.1115/1.1535447
Topics:
Wire
,
Flow (Dynamics)
,
Integrated circuits
,
Integrated circuit packaging
Finite Element Analysis of Mechanical Shock Responses of RF Connectors
J. Electron. Packag. March 2003, 125(1): 144–152.
doi: https://doi.org/10.1115/1.1536950
Topics:
Finite element analysis
,
Shock (Mechanics)
Technical Briefs
The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints
J. Electron. Packag. March 2003, 125(1): 153–156.
doi: https://doi.org/10.1115/1.1537070
Topics:
Cooling
,
Crystallization
,
Diffusion (Physics)
,
Intermetallic compounds
,
Solder joints
,
Solders
,
Tin
,
Temperature
,
Solidification
,
Ball-Grid-Array packaging
Open Defects in PBGA Assembly Solder Joints
J. Electron. Packag. March 2003, 125(1): 157–161.
doi: https://doi.org/10.1115/1.1536951
Topics:
Manufacturing
,
Solder joints
,
Solders
,
Soldering
,
Inspection
,
Thermal stability
,
Wetting
,
Printing
Thermoelectric Behavior of Solder
J. Electron. Packag. March 2003, 125(1): 161–162.
doi: https://doi.org/10.1115/1.1536952
Topics:
Solders
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