Topics: Design , Design methodology , Electronic systems , Flow (Dynamics) , Forced convection , Temperature , Thermal resistance , Junctions , Reynolds number , Reliability

A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

Kuo-Ning Chiang, Associate Professor,, Chang-Ming Liu, Graduate Assistant,

J. Electron. Packag. June 2001, 123(2): 127–131. doi: https://doi.org/10.1115/1.1339196

Abstract

View articletitled, A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads

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Topics: Reliability , Shapes , Solders , Thermal stresses , Ball-Grid-Array packaging , Geometry , Reflow soldering , Finite element analysis , Design

Applications of a Decomposed Analysis Procedure for Area-Array Packages

Terrace B. Thompson, Ganesh Subbarayan, Associate Professor

J. Electron. Packag. June 2001, 123(2): 132–140. doi: https://doi.org/10.1115/1.1339197

Abstract

View articletitled, Applications of a Decomposed Analysis Procedure for Area-Array Packages

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Topics: Displacement , Electronic packages , Errors , Finite element analysis , Optimization , Shear (Mechanics) , Solder joints , Solders , Finite element model

Papers on Reliability

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

Krishna Darbha, Abhijit Dasgupta, Professor

J. Electron. Packag. June 2001, 123(2): 141–146. doi: https://doi.org/10.1115/1.1328744

Abstract

View articletitled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

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Topics: Displacement , Finite element analysis , Potential energy , Stress , Stress analysis (Engineering) , Creep , Thermomechanics , Electronic products

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

Krishna Darbha, Abhijit Dasgupta, Professor

J. Electron. Packag. June 2001, 123(2): 147–155. doi: https://doi.org/10.1115/1.1328745

Abstract

View articletitled, A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

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Topics: Ball-Grid-Array packaging , Creep , Finite element analysis , Flip-chip devices , Manufacturing , Solders , Stress , Stress analysis (Engineering) , Durability , Temperature

Technical Brief

Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board

S. A. Harman and, K. D. Cole

J. Electron. Packag. June 2001, 123(2): 156–158. doi: https://doi.org/10.1115/1.1348011

Abstract

View articletitled, Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board

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Topics: Heat transfer , Printed circuit boards , Temperature , Temperature distribution , Fluids , Cooling , Circuit design , Forced convection , Numerical analysis