Topics: Circuits , Deformation , Displacement , Flip-chip devices , Flip-chip packages , Interferometry , Flip-chip assemblies , Metals , Shear deformation , Reliability

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

A. Q. Xu, H. F. Nied

J. Electron. Packag. December 2000, 122(4): 301–305. doi: https://doi.org/10.1115/1.1289768

Abstract

View articletitled, Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

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Topics: Corners (Structural elements) , Delamination , Epoxy adhesives , Epoxy resins , Finite element analysis , Fracture (Materials) , Silicon , Stress , Stress singularity , Geometry

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member

J. Electron. Packag. December 2000, 122(4): 306–310. doi: https://doi.org/10.1115/1.1289998

Abstract

View articletitled, Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With <em>Imperfect</em> Underfills

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Topics: Corners (Structural elements) , Delamination , Flip-chip assemblies , Flip-chip devices , Fracture (Materials) , Fracture mechanics , Solder joints , Solder masks , Solders , Stress

Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

John H. Lau, ASME Fellow, S.-W. Ricky Lee, ASME Member, Chris Chang

J. Electron. Packag. December 2000, 122(4): 311–316. doi: https://doi.org/10.1115/1.1289769

Abstract

View articletitled, Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

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Topics: Corners (Structural elements) , Creep , Semiconductor wafers , Shear (Mechanics) , Solder joints , Solders , Temperature , Finite element analysis , Reliability , Manufacturing

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

T. Elperin, A. Kornilov, G. Rudin

J. Electron. Packag. December 2000, 122(4): 317–322. doi: https://doi.org/10.1115/1.1289635

Abstract

View articletitled, Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

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Topics: Microcracks , Semiconductor wafers , Separation (Technology) , Temperature , Laser beams , Sprays , Elasticity , Stress , Temperature distribution , Relaxation (Physics)

Thermal Management of Surface Mount Power Magnetic Components

G. Refai-Ahmed, Mem. ASME,, M. M. Yovanovich, Fellow ASME,

J. Electron. Packag. December 2000, 122(4): 323–327. doi: https://doi.org/10.1115/1.1289634

Abstract

View articletitled, Thermal Management of Surface Mount Power Magnetic Components

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Topics: Computer simulation , Heat conduction , Surface mount packaging , Temperature , Thermal management , Thermal resistance , Winding (process) , Heat transfer , Wings , Packaging

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

S. M. Heinrich, S. Shakya, J. Liang, P. S. Lee

J. Electron. Packag. December 2000, 122(4): 328–334. doi: https://doi.org/10.1115/1.1289631

Abstract

View articletitled, An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

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Topics: Creep , Displacement , Shear (Mechanics) , Stiffness , Shear deformation , Shapes , Stress , Viscoelastic materials , Viscoelasticity , Solders

Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

Reza Ghaffarian

J. Electron. Packag. December 2000, 122(4): 335–340. doi: https://doi.org/10.1115/1.1289627

Abstract

View articletitled, Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

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Topics: Ball-Grid-Array packaging , Cycles , Failure , Failure mechanisms , Reliability , Temperature , Testing , Manufacturing , Ceramics

A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures

J. H. Ong, G. H. Lim

J. Electron. Packag. December 2000, 122(4): 341–349. doi: https://doi.org/10.1115/1.1289632

Abstract

View articletitled, A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures

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Topics: Boundary-value problems , Mode shapes , Optimization , Printed circuit boards , Vibration , Finite element analysis , Cantilevers , Algorithms , Density , Plates (structures)