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Issues
September 2000
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Factors Affecting the Operational Thermal Resistance of Electronic Components
J. Electron. Packag. September 2000, 122(3): 185–191.
doi: https://doi.org/10.1115/1.1286101
Topics:
Electronic components
,
Temperature
,
Thermal resistance
,
Junctions
Stress Analysis of Thermal Inclusions With Interior Voids and Cracks
J. Electron. Packag. September 2000, 122(3): 192–199.
doi: https://doi.org/10.1115/1.1286020
A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints
J. Electron. Packag. September 2000, 122(3): 200–206.
doi: https://doi.org/10.1115/1.1286121
Topics:
Creep
,
Damage
,
Solder joints
,
Solders
,
Fatigue life
,
Manufacturing
,
Density
,
Materials properties
,
Finite element analysis
,
Stress
Fatigue Life Analysis of Solder Joints in Flip Chip Bonding
J. Electron. Packag. September 2000, 122(3): 207–213.
doi: https://doi.org/10.1115/1.1286002
Topics:
Bonding
,
Fatigue life
,
Finite element methods
,
Flip-chip
,
Flip-chip devices
,
Solder joints
,
Solders
,
Thermal stresses
,
Dimensions
,
Finite element analysis
Reliability Analysis of Flip Chip Designs Via Computer Simulation
J. Electron. Packag. September 2000, 122(3): 214–219.
doi: https://doi.org/10.1115/1.1286122
Topics:
Computer simulation
,
Fatigue
,
Flip-chip
,
Flip-chip devices
,
Geometry
,
Materials properties
,
Reliability
,
Solder joints
,
Solders
,
Young's modulus
A Model of Crack Nucleation in Layered Electronic Assemblies Under Thermal Cycling
J. Electron. Packag. September 2000, 122(3): 220–226.
doi: https://doi.org/10.1115/1.1286100
Topics:
Damage
,
Fracture (Materials)
,
Nucleation (Physics)
,
Stress
,
Cycles
,
Microscale devices
Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry
J. Electron. Packag. September 2000, 122(3): 227–232.
doi: https://doi.org/10.1115/1.1286315
Topics:
Interferometry
,
Surface roughness
,
Warping
,
Microelectronic devices
Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
J. R. Culham, Associate Professor and Director, Mem. ASME,, M. M. Yovanovich, Professor Emeritus and Principal Scientific Advisor, Fellow ASME,, T. F. Lemczyk, Project Engineer,
J. Electron. Packag. September 2000, 122(3): 233–239.
doi: https://doi.org/10.1115/1.1287928
Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages
J. Electron. Packag. September 2000, 122(3): 240–246.
doi: https://doi.org/10.1115/1.1289761
Topics:
Cooling
,
Heat sinks
,
Optimization
,
Pins (Engineering)
,
Pressure drop
,
Thermal resistance
,
Impingement cooling
,
Flow (Dynamics)
,
Fins
,
Flow visualization
LGA Connectors: An Automated Design Technique for a Shrinking Design Space
J. Electron. Packag. September 2000, 122(3): 247–254.
doi: https://doi.org/10.1115/1.1286021
Topics:
Design
,
Optimization
,
Shapes
,
Stress
,
Finite element analysis
,
B-splines
CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis
J. Electron. Packag. September 2000, 122(3): 255–261.
doi: https://doi.org/10.1115/1.1286120
Topics:
Creep
,
Finite element analysis
,
Solder joints
,
Temperature
,
Stress
,
Solders
A Study of Process-Induced Residual Stress in PBGA Packages
J. Electron. Packag. September 2000, 122(3): 262–266.
doi: https://doi.org/10.1115/1.1285983
Topics:
Calibration
,
Displacement
,
Stress
,
Residual stresses
,
Interferometry
A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate
J. Electron. Packag. September 2000, 122(3): 267–273.
doi: https://doi.org/10.1115/1.1287930
Topics:
Stress
,
Thin films
,
Fracture (Materials)
,
Composite materials
,
Residual stresses
,
Deformation
The Green Function and Its Application to Heat Transfer in a Low Permeability Porous Channel
J. Electron. Packag. September 2000, 122(3): 274–278.
doi: https://doi.org/10.1115/1.1287929
Topics:
Heat
,
Heat transfer
,
Permeability
,
Porous materials
,
Temperature
,
Flow (Dynamics)
,
Heat flux
,
Heat sinks
Technical Briefs
Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria
J. Electron. Packag. September 2000, 122(3): 279–280.
doi: https://doi.org/10.1115/1.1286105
Topics:
Failure
,
Reliability
,
Solders
,
Stress
,
Molding
,
Solder joints
,
Thermal stresses
,
Integrated circuits
,
Failure analysis
,
Integrated circuit packaging
Tools for Stress Analysis of Microelectronic Structures
J. Electron. Packag. September 2000, 122(3): 280–282.
doi: https://doi.org/10.1115/1.1286104
Topics:
Stress analysis (Engineering)
Heat Transfer From a Finned Surface in Ducted Air Jet Suction and Impingement
J. Electron. Packag. September 2000, 122(3): 282–285.
doi: https://doi.org/10.1115/1.1286106
Topics:
Air jets
,
Heat sinks
,
Heat transfer
,
Nozzles
,
Suction
,
Thermal resistance
,
Flow (Dynamics)
,
Heat transfer coefficients
,
Reynolds number
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