Topics: Displacement , Solder joints , Manufacturing , Materials properties , Shear (Mechanics) , Boundary-value problems , Die cutting , Dimensions , Disks , Finite element analysis

Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging Technique

H. U. Akay, N. H. Paydar, A. Bilgic

J. Electron. Packag. December 1997, 119(4): 228–235. doi: https://doi.org/10.1115/1.2792241

Abstract

View articletitled, Fatigue Life Predictions for Thermally Loaded Solder Joints Using a Volume-Weighted Averaging Technique

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Topics: Fatigue life , Solder joints , Stress , Fatigue , Cycles , Finite element analysis , Curve fitting , Deformation , Failure , Shear (Mechanics)

0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

Xiaoping Shui, D. D. L. Chung

J. Electron. Packag. December 1997, 119(4): 236–238. doi: https://doi.org/10.1115/1.2792242

Abstract

View articletitled, 0.4 μm Diameter Nickel-Filament Silicone-Matrix Resilient Composites for Electromagnetic Interference Shielding

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Topics: Composite materials , Electromagnetic interference , Nickel , Silicones , Cables , Electrical resistivity , Gaskets

Transient Response of Microchannel Heat Sinks in a Silicon Wafer

J. R. Rujano, M. M. Rahman

J. Electron. Packag. December 1997, 119(4): 239–246. doi: https://doi.org/10.1115/1.2792243

Abstract

View articletitled, Transient Response of Microchannel Heat Sinks in a Silicon Wafer

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Topics: Heat sinks , Microchannels , Semiconductor wafers , Transients (Dynamics) , Fluids , Heat transfer , Reynolds number , Temperature , Forced convection , Heat

Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

S. Han, K. K. Wang, D. L. Crouthamel

J. Electron. Packag. December 1997, 119(4): 247–254. doi: https://doi.org/10.1115/1.2792245

Abstract

View articletitled, Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation

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Topics: Semiconductors (Materials) , Wire , Cavities , Epoxy adhesives , Epoxy resins , Manufacturing , Materials properties , Molding , Shapes , Temperature

Z-Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

L. Li, D. D. L. Chung

J. Electron. Packag. December 1997, 119(4): 255–259. doi: https://doi.org/10.1115/1.2792246

Abstract

View articletitled, <em>Z</em>-Axis Anisotropic Electrically Conducting Polymer-Matrix Composite Film

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Topics: Anisotropy , Composite materials , Polymers , Electrical resistivity , Particulate matter , Pressure , Copper , Relaxation (Physics) , Stress

The Impact of Interfacial Adhesion on PTH and Via Stress State

G. Subbarayan, K. Ramakrishna, B. G. Sammakia

J. Electron. Packag. December 1997, 119(4): 260–267. doi: https://doi.org/10.1115/1.2792247

Abstract

View articletitled, The Impact of Interfacial Adhesion on PTH and Via Stress State

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Topics: Adhesion , Stress , Laminates , Fracture (Materials) , Fracture (Process) , Plating , Drills (Tools) , Finite element analysis , Junctions , Manufacturing

Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

A. F. Elkouh, N. Ramasubramanian, T. F. Hsu, N. J. Nigro, S. M. Heinrich, P. S. Lee, D. Shangguan

J. Electron. Packag. December 1997, 119(4): 268–274. doi: https://doi.org/10.1115/1.2792248

Abstract

View articletitled, Prediction of Solder Geometry for an Axisymmetric Through-Hole Joint

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Topics: Geometry , Solders , Solder joints , Differential equations , Printed circuit boards

Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters

D. Yu, T. A. Ameel, R. O. Warrington, R. F. Barron

J. Electron. Packag. December 1997, 119(4): 275–280. doi: https://doi.org/10.1115/1.2792249

Abstract

View articletitled, Conjugate Heat Transfer With Buoyancy Effects From Micro-Chip Sized Repeated Heaters

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Topics: Buoyancy , Heat transfer , Integrated circuits , Mixed convection , Flow (Dynamics) , Temperature , Thermal conductivity , Forced convection , Convection , Electronics

Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

J. W. Tierney, J. W. Eischen

J. Electron. Packag. December 1997, 119(4): 281–287. doi: https://doi.org/10.1115/1.2792250

Abstract

View articletitled, Residual Stress Analysis of Bimaterial Strips Under Multiple Thermal Loading

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Topics: Algebra , Equilibrium (Physics) , Finite element analysis , Microelectronic devices , Stress , Stress analysis (Engineering) , Stress concentration , Strips