Topics: Reliability , Shape optimization , Solder joints , Optimization , Approximation , Design , Electronic packages , Fatigue life , Artificial neural networks , Ball-Grid-Array packaging

The Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints

G. Subbarayan, A. Deshpande

J. Electron. Packag. September 1997, 119(3): 156–162. doi: https://doi.org/10.1115/1.2792228

Abstract

View articletitled, The Nature of Centroidal Locus in Misaligned Flip-Chip Solder Joints

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Topics: Flip-chip , Solder joints , Cross section (Physics) , Three-dimensional models , Design , Optoelectronic devices , Shapes

Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

W. Jung, J. H. Lau, Y.-H. Pao

J. Electron. Packag. September 1997, 119(3): 163–170. doi: https://doi.org/10.1115/1.2792229

Abstract

View articletitled, Nonlinear Analysis of Full-Matrix and Perimeter Plastic Ball Grid Array Solder Joints

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Topics: Ball-Grid-Array packaging , Solder joints , Reliability , Deformation , Finite element analysis , Manufacturing , Ball-Grid-Array packages , Ceramics , Computation , Constitutive equations

Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation

T. E. Wong, L. A. Kachatorian, B. D. Tierney

J. Electron. Packag. September 1997, 119(3): 171–176. doi: https://doi.org/10.1115/1.2792230

Abstract

View articletitled, Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation

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Topics: Fatigue life , Solder joints , Wings , Manufacturing , Solders , Design , Modeling , Diluents , Finite element analysis , Finite element model

A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis

S. Ling, A. Dasgupta

J. Electron. Packag. September 1997, 119(3): 177–182. doi: https://doi.org/10.1115/1.2792231

Abstract

View articletitled, A Nonlinear Multi-Domain Thermomechanical Stress Analysis Method for Surface-Mount Solder Joints—Part II: Viscoplastic Analysis

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Topics: Solder joints , Stress analysis (Engineering) , Surface mount packaging , Thermomechanics , Stress , Deformation , Displacement , Potential energy , Printed circuit boards , Materials properties

Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

K. Darbha, S. Ling, A. Dasgupta

J. Electron. Packag. September 1997, 119(3): 183–188. doi: https://doi.org/10.1115/1.2792232

Abstract

View articletitled, Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading

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Topics: Stress analysis (Engineering) , Surface mount packaging , Printed circuit boards , Solder joints , Stress , Vibration , Boundary-value problems , Damage , Deformation , Fatigue

Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study

B. Han

J. Electron. Packag. September 1997, 119(3): 189–196. doi: https://doi.org/10.1115/1.2792233

Abstract

View articletitled, Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study

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Topics: Deformation , Solders , Cycles , Manufacturing , Ceramics , Displacement , Interferometry , Reliability , Shapes , Thermomechanics

Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

R. C. Dunne, S. K. Sitaraman

J. Electron. Packag. September 1997, 119(3): 197–203. doi: https://doi.org/10.1115/1.2792234

Abstract

View articletitled, Warpage and Interfacial Stress Distribution in a Single-Level Integrated Module (SLIM)

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Topics: Stress concentration , Warping , Thermomechanics , Delamination , Design , Dielectric materials , Electronic components , Failure , Shear (Mechanics) , Stress

Determination of Fracture Toughness of Thermally Conductive Adhesives

E. Jih, Y.-H. Pao, X. Song, C. Larner

J. Electron. Packag. September 1997, 119(3): 204–207. doi: https://doi.org/10.1115/1.2792235

View articletitled, Determination of Fracture Toughness of Thermally Conductive Adhesives

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Topics: Adhesives , Fracture toughness

Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

J. H. Lau, K.-L. Chen

J. Electron. Packag. September 1997, 119(3): 208–212. doi: https://doi.org/10.1115/1.2792236

Abstract

View articletitled, Thermal and Mechanical Evaluations of a Cost-Effective Plastic Ball Grid Array Package

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Topics: Ball-Grid-Array packages , Ball-Grid-Array packaging , Copper , Deflection , Epoxy adhesives , Epoxy resins , Flat heat pipes , Glass , Printed circuit boards , Temperature distribution