Topics: Design , Resistors , Solder joints , Finite element analysis , Capacitors , Cracking (Materials) , Creep , Electronic packaging , Failure , Fatigue

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Z. Guo, Yi-Hsin Pao, H. Conrad

J. Electron. Packag. June 1995, 117(2): 100–104. doi: https://doi.org/10.1115/1.2792074

Abstract

View articletitled, Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

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Topics: Deformation , Solder joints , Temperature , Shear rate , Shear stress , Creep , Diffusion (Physics) , Dislocations , Grain size , High temperature

Undercooling of 63SN-37PB Solder Pastes

Zequn Mei

J. Electron. Packag. June 1995, 117(2): 105–108. doi: https://doi.org/10.1115/1.2792075

Abstract

View articletitled, Undercooling of 63SN-37PB Solder Pastes

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Topics: Solders , Supercooling , Aluminum , Cooling , Copper , Solidification , Wetting , Manufacturing , Nucleation (Physics) , Solder joints

Comparison of LCC Solder Joint Life Predictions With Experimental Data

Liang-chi Wen, Ronald G. Ross, Jr.

J. Electron. Packag. June 1995, 117(2): 109–115. doi: https://doi.org/10.1115/1.2792076

Abstract

View articletitled, Comparison of LCC Solder Joint Life Predictions With Experimental Data

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Topics: Solder joints , Algorithms , Pins (Engineering) , Stress , Temperature , Failure , Electronic packaging , Fatigue , Ceramics , Computer software

Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach

Ahmer R. Syed

J. Electron. Packag. June 1995, 117(2): 116–122. doi: https://doi.org/10.1115/1.2792077

Abstract

View articletitled, Creep Crack Growth Prediction of Solder Joints During Temperature Cycling—An Engineering Approach

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Topics: Creep , Fracture (Materials) , Solder joints , Temperature , Damage , Density , Fatigue life , Finite element analysis , Grain boundaries , Ceramics

Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress Model

V. K. Gupta, D. B. Barker

J. Electron. Packag. June 1995, 117(2): 123–129. doi: https://doi.org/10.1115/1.2792078

Abstract

View articletitled, Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress Model

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Topics: Fatigue life , Modeling , Solder joints , Stress , Finite element analysis , Simulation , Electronics , Experimental design , Finite element methods , Materials properties

Energy Approach to the Fatigue of 60/40 Solder: Part I—Influence of Temperature and Cycle Frequency

H. D. Solomon, E. D. Tolksdorf

J. Electron. Packag. June 1995, 117(2): 130–135. doi: https://doi.org/10.1115/1.2792079

Abstract

View articletitled, Energy Approach to the Fatigue of 60/40 Solder: Part I—Influence of Temperature and Cycle Frequency

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Topics: Cycles , Fatigue , Solders , Temperature , Fatigue life , Flow (Dynamics) , Stress

Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

Peter A. Engel, Shou-Chien Chou

J. Electron. Packag. June 1995, 117(2): 136–140. doi: https://doi.org/10.1115/1.2792080

Abstract

View articletitled, Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

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Topics: Deformation , Solder joints , Thermal stresses , Solders , Temperature , Stress , Creep , Pins (Engineering) , Stress-strain curves , Tin

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan

J. Electron. Packag. June 1995, 117(2): 141–146. doi: https://doi.org/10.1115/1.2792081

Abstract

View articletitled, Simulation of the Influence of Manufacturing Quality on Reliability of Vias

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Topics: Manufacturing , Reliability , Simulation , Plating , Buckling , Cycles , Design , Design engineering , Electronic packages , Failure

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

G. Ganguly, A. Dasgupta

J. Electron. Packag. June 1995, 117(2): 147–152. doi: https://doi.org/10.1115/1.2792082

Abstract

View articletitled, Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

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Topics: Copper , Damage , Deformation , Failure analysis , Finite element analysis , Fourier series , Manufacturing , Materials properties , Pins (Engineering) , Printed circuit boards