Volume 115 Issue 1 | J. Electron. Packag.

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Volume 115, Issue 1

March 1993

ISSN 1043-7398

EISSN 1528-9044

Research Papers

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Yi-Hsin Pao, Ratan Govila, Scott Badgley, Edward Jih

J. Electron. Packag. March 1993, 115(1): 1–8. doi: https://doi.org/10.1115/1.2909296

Abstract

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Topics: Fatigue , Finite element analysis , Fracture (Materials) , Solder joints , Solders , Stress , Creep , Alloys , Cycles , Failure

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Hideo Miura, Makoto Kitano, Asao Nishimura, Sueo Kawai

J. Electron. Packag. March 1993, 115(1): 9–15. doi: https://doi.org/10.1115/1.2909307

Abstract

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Topics: Silicon chips , Temperature , Thermal stresses , Stress , Cycles , Molding , Cooling , Heating , Relaxation (Physics) , Steady state

Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

V. Sarihan

J. Electron. Packag. March 1993, 115(1): 16–21. doi: https://doi.org/10.1115/1.2909295

Abstract

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Topics: Collapse , Simulation , Solder joints , Temperature , Solders , Alloys , Creep , Design , Electronic packages , Flip-chip

Torsion of Elastically Coupled Plates With Applications to Electronic Packaging

P. A. Engel, Yun Ling

J. Electron. Packag. March 1993, 115(1): 22–27. doi: https://doi.org/10.1115/1.2909297

Abstract

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Topics: Electronic packaging , Plates (structures) , Torsion , Circuits , Electronics , Plate theory , Stiffness , Stress

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

J. C. W. van Vroonhoven

J. Electron. Packag. March 1993, 115(1): 28–33. doi: https://doi.org/10.1115/1.2909298

Abstract

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Topics: Adhesion , Delamination , Integrated circuits , Stress singularity , Fracture (Materials) , Failure , Fracture (Process) , Silicon chips , Stress , Temperature

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1993, 115(1): 34–38. doi: https://doi.org/10.1115/1.2909299

Abstract

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Topics: Packaging , Simulation , Stress , Transients (Dynamics) , Temperature , Thermal stresses , Composite materials , Delamination , Electronic equipment , Elongation

Displacement-Limited Buckling of an Optical Fiber

W. W. King

J. Electron. Packag. March 1993, 115(1): 39–43. doi: https://doi.org/10.1115/1.2909300

Abstract

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Topics: Buckling , Displacement , Optical fiber , Fibers , Stress , Deflection

Application of Impedance Spectroscopy for On-Line Monitoring of Solder Paste

C. R. Herman, V. A. Skormin, G. R. Westby

J. Electron. Packag. March 1993, 115(1): 44–54. doi: https://doi.org/10.1115/1.2909301

Abstract

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Topics: Electrochemical impedance spectroscopy , Solders , Manufacturing , Statistical analysis , Statistical process control , Surface mount assemblies

A Detailed Thermal Model of the Infrared Reflow Soldering Process

M. A. Eftychiou, T. L. Bergman, G. Y. Masada

J. Electron. Packag. March 1993, 115(1): 55–62. doi: https://doi.org/10.1115/1.2909302

Abstract

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Topics: Reflow soldering , Heat conduction , Heat transfer , Mixed convection , Convection , Manufacturing , Ovens , Radiation (Physics) , Solders , Temperature effects

Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process

Sa-Yoon Kang, H. Xie, Y. C. Lee

J. Electron. Packag. March 1993, 115(1): 63–70. doi: https://doi.org/10.1115/1.2909303

Abstract

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Topics: Bonding , Flip-chip , Fuzzy logic , Modeling , Manufacturing , Aluminum , End effectors , Epoxy adhesives , Epoxy resins , Mechanical properties

Local Characteristics of Convective Heat Transfer From Simulated Microelectronic Chips to Impinging Submerged Round Water Jets

H. Sun, C. F. Ma, W. Nakayama

J. Electron. Packag. March 1993, 115(1): 71–77. doi: https://doi.org/10.1115/1.2909304

Abstract

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Topics: Convection , Jets , Water , Heat transfer , Integrated circuits , Nozzles , Turbulence

Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling

C. O. Gersey, I. Mudawar

J. Electron. Packag. March 1993, 115(1): 78–88. doi: https://doi.org/10.1115/1.2909305

Abstract

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Topics: Boiling , Critical heat flux , Flow (Dynamics) , Nucleate boiling , Subcooling , Heat transfer coefficients , Coolants , Forced convection , Multi-chip modules

Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling

I. Mudawar, T. M. Anderson

J. Electron. Packag. March 1993, 115(1): 89–100. doi: https://doi.org/10.1115/1.2909306

Abstract

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Topics: Cooling , Optimization , Pool boiling , Boiling , Boundary-value problems , Flux (Metallurgy) , Heat , Metal surfaces , Nucleate boiling , Subcooling

Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry

J. W. M. Spicer, M. G. Bevan, W. D. Kerns, H. S. Feldmesser

J. Electron. Packag. March 1993, 115(1): 101–105. doi: https://doi.org/10.1115/1.2909287

Abstract

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Topics: Adhesives , Electronics , Heat sinks , Radiation measurement , Space vehicles , Thermal characterization , Epoxy adhesives , Epoxy resins , Delamination , Fracture (Materials)

An Experimental Investigation of a Staggered Array of Heatsinks in the Hydrodynamic and Thermal Entrance Regions of a Duct

Sarah M. Bazydola, Mohammad E. Taslim

J. Electron. Packag. March 1993, 115(1): 106–111. doi: https://doi.org/10.1115/1.2909288

Abstract

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Topics: Ducts , Entrance region , Reynolds number , Electronic packages , Temperature , Computers , Design , Heat transfer coefficients , Printed circuit boards

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

M. T. North, C. T. Avedisian

J. Electron. Packag. March 1993, 115(1): 112–117. doi: https://doi.org/10.1115/1.2909290

Abstract

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Topics: Cooling , Heat pipes , Power semiconductor devices , Heat , Condensers (steam plant) , Flux (Metallurgy) , Temperature , Water , Copper powders , Design

A Design Approach for the Systematic Improvement of Support Locations for Vibrating Circuit Cards

J. M. Pitarresi, A. V. Di Edwardo

J. Electron. Packag. March 1993, 115(1): 118–123. doi: https://doi.org/10.1115/1.2909291

Abstract

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Topics: Circuits , Design , Algorithms , Finite element analysis , Finite element methods , Modeling , Structural dynamics

Guidelines for the Use of Approximations in Shock Response Analysis of Electronic Assemblies

R. F. Keltie, K. J. Falter

J. Electron. Packag. March 1993, 115(1): 124–130. doi: https://doi.org/10.1115/1.2909292

Abstract

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Topics: Approximation , Shock (Mechanics) , Boundary-value problems , Computers , Finite element analysis , Stiffness

Technical Briefs

An Approximate Thermal Contact Conductance Correlation

V. W. Antonetti, T. D. Whittle, R. E. Simons

J. Electron. Packag. March 1993, 115(1): 131–134. doi: https://doi.org/10.1115/1.2909293

Abstract

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Topics: Contact resistance , Surface roughness , Errors , Surface texture

Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures

T. Y. Tom Lee, Mali Mahalingam, Peter J. C. Normington

J. Electron. Packag. March 1993, 115(1): 134–137. doi: https://doi.org/10.1115/1.2909294

Abstract

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Topics: Critical heat flux , Dielectric liquids , Pool boiling , Subcooling , Boiling , Data collection , Phase transition temperature , Temperature

Research Papers

An Experimental and Finite Element Study of Thermal Fatigue Fracture of PbSn Solder Joints

Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling

Temperature Dependent Viscoplastic Simulation of Controlled Collapse Solder Joint Under Thermal Cycling

Torsion of Elastically Coupled Plates With Applications to Electronic Packaging

Effects of Adhesion and Delamination on Stress Singularities in Plastic-Packaged Integrated Circuits

Analysis and Simulation of Thermal Transients and Resultant Stresses and Strains in TAB Packaging

Displacement-Limited Buckling of an Optical Fiber

Application of Impedance Spectroscopy for On-Line Monitoring of Solder Paste

A Detailed Thermal Model of the Infrared Reflow Soldering Process

Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process

Local Characteristics of Convective Heat Transfer From Simulated Microelectronic Chips to Impinging Submerged Round Water Jets

Nucleate Boiling and Critical Heat Flux From Protruded Chip Arrays During Flow Boiling

Optimization of Enhanced Surfaces for High Flux Chip Cooling by Pool Boiling

Thermal Characterization of Heat Sink Adhesive Systems for Spacecraft Electronics by Time-Resolved Infrared Radiometry

An Experimental Investigation of a Staggered Array of Heatsinks in the Hydrodynamic and Thermal Entrance Regions of a Duct

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

A Design Approach for the Systematic Improvement of Support Locations for Vibrating Circuit Cards

Guidelines for the Use of Approximations in Shock Response Analysis of Electronic Assemblies

Technical Briefs

An Approximate Thermal Contact Conductance Correlation

Subcooled Pool Boiling Critical Heat Flux in Dielectric Liquid Mixtures

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