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Issues

Volume 114, Issue 1
March 1992
Journal of Electronic Packaging Cover Image for Volume 114, Issue 1
ISSN 1043-7398
EISSN 1528-9044
In this Issue

Research Papers

A Bonded Joint Analysis for Surface Mount Components
S. E. Yamada
J. Electron. Packag. March 1992, 114(1): 1–7. doi: https://doi.org/10.1115/1.2905436
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Topics: Design , Shear (Mechanics) , Shear stress , Stress , Stress concentration , Surface mount components , Surface mount devices , Surface mount packaging
Influence of Selected Design Variables on Thermo-Mechanical Stress Distributions in Plated-Through-Hole Structures
S. M. Bhandarkar, A. Dasgupta, D. Barker, M. Pecht, W. Engelmaier
J. Electron. Packag. March 1992, 114(1): 8–13. doi: https://doi.org/10.1115/1.2905447
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Topics: Design , Stress , Thermomechanics , Finite element methods , Failure , Anisotropy , Boundary-value problems , Epoxy adhesives , Epoxy resins , Fatigue life
The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions
Ann M. Anderson, Robert J. Moffat
J. Electron. Packag. March 1992, 114(1): 14–21. doi: https://doi.org/10.1115/1.2905435
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Topics: Flow (Dynamics) , Heat transfer coefficients , Heat transfer , Pressure drop , Electronics , Fluctuations (Physics) , Forced convection , Heat , Operating temperature , Turbulence
The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 2—Modeling Flatpack Data as a Function of Channel Turbulence
A. M. Anderson, R. J. Moffat
J. Electron. Packag. March 1992, 114(1): 22–28. doi: https://doi.org/10.1115/1.2905437
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Topics: Heat transfer coefficients , Modeling , Turbulence , Heat transfer , Pressure drop , Electronics , Fluctuations (Physics) , Forced convection , Heat , Operating temperature
Laminar-Transitional Convection From Repeated Ribs in a Channel
R. A. Wirtz, Weiming Chen
J. Electron. Packag. March 1992, 114(1): 29–34. doi: https://doi.org/10.1115/1.2905438
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Topics: Air flow , Convection , Electronic packages , Geometry , Heat transfer , Heat transfer coefficients , Pressure drop , Turbulence
Heat Transfer Enhancement by Flow Destabilization in Electronic Chip Configurations
C. H. Amon
J. Electron. Packag. March 1992, 114(1): 35–40. doi: https://doi.org/10.1115/1.2905439
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Topics: Flow (Dynamics) , Heat transfer , Computer simulation , Convection , Cooling systems , Design , Energy dissipation , Oscillations , Reynolds number , Traveling waves
Thermal Effects During Infrared Solder Reflow—Part I: Heat Transfer Mechanisms
N. J. Fernandes, T. L. Bergman, G. Y. Masada
J. Electron. Packag. March 1992, 114(1): 41–47. doi: https://doi.org/10.1115/1.2905440
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Topics: Heat transfer , Reflow soldering , Temperature effects , Ovens , Buoyancy , Computer simulation , Convection , Forced convection , Heating , Transients (Dynamics)
Thermal Effects During Infrared Solder Reflow—Part II: A Model of the Reflow Process
M. Eftychiou, T. L. Bergman, G. Y. Masada
J. Electron. Packag. March 1992, 114(1): 48–54. doi: https://doi.org/10.1115/1.2905441
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Topics: Reflow soldering , Temperature effects , Engineering simulation , Manufacturing , Ovens , Radiative heat transfer , Simulation , Circuits , Computer simulation , Transient heat transfer
Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: I—Single-Phase Convection
T. J. Heindel, F. P. Incropera, S. Ramadhyani
J. Electron. Packag. March 1992, 114(1): 55–62. doi: https://doi.org/10.1115/1.2905442
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Topics: Convection , Cooling , Heat , Flow (Dynamics) , Heat transfer , Reynolds number , Buoyancy , Forced convection , Turbulence , Fluids
Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling
T. J. Heindel, S. Ramadhyani, F. P. Incropera
J. Electron. Packag. March 1992, 114(1): 63–70. doi: https://doi.org/10.1115/1.2905443
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Topics: Boiling , Cooling , Forced convection , Heat , Nucleate boiling , Fluids , Flow (Dynamics) , Heat flux , Subcooling , Heat transfer
Theoretical and Experimental Investigation of Laser Drilling in a Partially Transparent Medium
T. Nowak, R. J. Pryputniewicz
J. Electron. Packag. March 1992, 114(1): 71–80. doi: https://doi.org/10.1115/1.2905444
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Topics: Drilling , Lasers , Transparency , Laser beams , Shapes , Computer simulation , Errors , Experimental analysis , Geometry , Temperature
Heat Transfer and Flow Characteristics of Two-Dimensional Jets Impinging on Heated Protrusions With Crossflow of the Spent Air
G. L. Whidden, J. Stevens, B. W. Webb
J. Electron. Packag. March 1992, 114(1): 81–87. doi: https://doi.org/10.1115/1.2905445
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Topics: Flow (Dynamics) , Heat transfer , Jets , Nozzles , Reynolds number , Turbulence , Heat , Lasers , Velocimeters
Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry
Yifan Guo, Charles G. Woychik
J. Electron. Packag. March 1992, 114(1): 88–92. doi: https://doi.org/10.1115/1.2905446
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Topics: Interferometry , Solder joints , Strain measurement , Surface mount components , Reliability , Solders , Thermal expansion , Dimensions , Electronic packages , Failure

Technical Briefs

Automated Measurement of Flank Wear of Circuit Board Drills
Ciro N. Ramirez, P.E., R. Joe Thornhill, P.E.
J. Electron. Packag. March 1992, 114(1): 93–96. doi: https://doi.org/10.1115/1.2905448
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Topics: Drills (Tools) , Printed circuit boards , Wear , Drilling , Machinery
Structural Analyses of Spacecraft Electronic Packages
S. Kannappan, V. Kunukkassril
J. Electron. Packag. March 1992, 114(1): 96–99. doi: https://doi.org/10.1115/1.2905449
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Topics: Electronic packages , Space vehicles , Structural analysis , Finite element methods , Stress , Computer software , Design , Electronics , Manufacturing , Modal analysis

Book Reviews

Solder Joint Reliability—Theory and Applications
John H. Lau, Editor, Peter A. Engel, Reviewer
J. Electron. Packag. March 1992, 114(1): 100. doi: https://doi.org/10.1115/1.2905434
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Topics: Reliability theory , Solder joints
All Issues
Optimization of the reliability of ball grid array solder joints under random vibration conditions using an improved BP neural network-based particle swarm algorithm
J. Electron. Packag
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection
J. Electron. Packag
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems
J. Electron. Packag (September 2025)
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics
J. Electron. Packag (September 2025)
Submillimeter Reflector for Edge-Emitting Laser Package
J. Electron. Packag (September 2025)
  • Online ISSN 1528-9044
  • Print ISSN 1043-7398

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