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Issues
December 1991
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Temperature Dependence of the Mechanical Properties of GaAs Wafers
J. Electron. Packag. December 1991, 113(4): 331–336.
doi: https://doi.org/10.1115/1.2905416
Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
J. Electron. Packag. December 1991, 113(4): 337–342.
doi: https://doi.org/10.1115/1.2905417
Topics:
Flip-chip
,
Modeling
,
Solder joints
,
Soldering
,
Solders
,
Energy conservation
,
Manufacturing
,
Reflow soldering
,
Reliability
,
Stress
A Study of Forces and Motion Generated During Pulsed Laser Welding of Optical Packages
J. Electron. Packag. December 1991, 113(4): 343–349.
doi: https://doi.org/10.1115/1.2905418
Topics:
Laser welding
,
Lasers
,
Cooling
,
Dynamics (Mechanics)
,
Laser beams
,
Manufacturing
,
Shrinkage (Materials)
,
Thermal stresses
,
Waves
,
Welding
Thermal Stresses in Layered Electrical Assemblies Bonded With Solder
J. Electron. Packag. December 1991, 113(4): 350–354.
doi: https://doi.org/10.1115/1.2905419
Elastoplastic Analysis of Bimaterial Beams Subjected to Thermal Loads
J. Electron. Packag. December 1991, 113(4): 355–358.
doi: https://doi.org/10.1115/1.2905420
Topics:
Stress
,
Finite element analysis
Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources
J. Electron. Packag. December 1991, 113(4): 359–366.
doi: https://doi.org/10.1115/1.2905421
Topics:
Heat
,
Impingement cooling
,
Reynolds number
,
Boundary layers
,
Heat transfer
,
Heat transfer coefficients
,
Heating
,
Manifolds
,
Multi-chip modules
,
Nozzles
Fluid Dynamic Characteristics of the Flow Over an Array of Large Roughness Elements
J. Electron. Packag. December 1991, 113(4): 367–373.
doi: https://doi.org/10.1115/1.2905422
Thermal-Fluid Interactions of Neighboring Components on Air-Cooled Circuit Boards
J. Electron. Packag. December 1991, 113(4): 374–381.
doi: https://doi.org/10.1115/1.2905423
Combined Conduction, Natural Convection, and Radiation Heat Transfer in an Electronic Chassis
J. Electron. Packag. December 1991, 113(4): 382–391.
doi: https://doi.org/10.1115/1.2905424
Constriction Resistance in Rectangular Bodies
J. Electron. Packag. December 1991, 113(4): 392–396.
doi: https://doi.org/10.1115/1.2905425
Topics:
Boundary-value problems
,
Heat
,
Heat conduction
,
Temperature
Effects of Configuration on Plastic Package Stresses
J. Electron. Packag. December 1991, 113(4): 397–404.
doi: https://doi.org/10.1115/1.2905426
Topics:
Stress
,
Coating processes
,
Coatings
,
Compressive stress
,
Molding
,
Finite element analysis
,
Silicones
,
Simulation
,
Strain gages
Development of Hermetic Microminiature Connectors
J. Electron. Packag. December 1991, 113(4): 405–409.
doi: https://doi.org/10.1115/1.2905427
Modeling and Performance Analysis of a Flexible PCB Assembly Station Using Petri Nets
J. Electron. Packag. December 1991, 113(4): 410–416.
doi: https://doi.org/10.1115/1.2905428
Nickel Fiber Silicone-Matrix Composites as Resilient Electrical Conductors
J. Electron. Packag. December 1991, 113(4): 417–420.
doi: https://doi.org/10.1115/1.2905429
Topics:
Composite materials
,
Fibers
,
Nickel
,
Silicones
,
Electrical resistivity
,
Compression
,
Copper
,
Electromagnetic interference
,
Gaskets
,
Heating
Technical Briefs
Mechanical Deformation of Leadframe Assemblies in Plastic Packages During Molding
J. Electron. Packag. December 1991, 113(4): 421–425.
doi: https://doi.org/10.1115/1.2905430
Topics:
Deformation
,
Molding
,
Deflection
,
Flow (Dynamics)
,
Stress
,
Density
,
Design
,
Diluents
,
Gates (Closures)
,
Geometry
A Note on the Determination of the Thermal Stresses in Multi-Metal Beams Subjected to Temperature Variations
J. Electron. Packag. December 1991, 113(4): 425–427.
doi: https://doi.org/10.1115/1.2905431
Topics:
Metals
,
Temperature
,
Thermal stresses
,
Linear systems
,
Stress
An Improved Procedure for the Determination of the Elastic Constants of Component-Lead-Board Assemblies
J. Electron. Packag. December 1991, 113(4): 427–430.
doi: https://doi.org/10.1115/1.2905432
Topics:
Elastic constants
,
Torsion
,
Computer simulation
Effects of Peeling Stresses in Bimaterial Assembly
J. Electron. Packag. December 1991, 113(4): 431–433.
doi: https://doi.org/10.1115/1.2905433
Topics:
Manufacturing
,
Stress
,
Temperature
,
Delamination
,
Epoxy adhesives
,
Epoxy resins
,
Hardening (Curing)
,
Nickel alloys
,
Strips
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