Volume 113 Issue 3 | J. Electron. Packag.

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Volume 113, Issue 3

September 1991

ISSN 1043-7398

EISSN 1528-9044

Research Papers

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

D. A. Bittle, J. C. Suhling, R. E. Beaty, R. C. Jaeger, R. W. Johnson

J. Electron. Packag. September 1991, 113(3): 203–215. doi: https://doi.org/10.1115/1.2905397

Abstract

View articletitled, Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

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Topics: Electronic packages , Sensors , Stress , Structural analysis , Semiconductor wafers , Crystals , Design , Diamonds , Heat conduction , Integrated circuits

A Fundamental Study of the Tape Automated Bonding Process

W. T. Chen, J. Z. Raski, J. R. Young, D. Y. Jung

J. Electron. Packag. September 1991, 113(3): 216–225. doi: https://doi.org/10.1115/1.2905398

View articletitled, A Fundamental Study of the Tape Automated Bonding Process

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Topics: Bonding

Stress Analyses of Flip TAB Interconnects in Multi-Chip Module Assembly

Ben Nagaraj, Mali Mahalingam

J. Electron. Packag. September 1991, 113(3): 226–232. doi: https://doi.org/10.1115/1.2905399

Abstract

View articletitled, Stress Analyses of Flip TAB Interconnects in Multi-Chip Module Assembly

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Topics: Manufacturing , Multi-chip modules , Stress analysis (Engineering) , Stress , Finite element methods , Bearings , Design , Energy dissipation , Failure , Heat

Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging

K. Zouari, Y. C. Lee

J. Electron. Packag. September 1991, 113(3): 233–239. doi: https://doi.org/10.1115/1.2905400

Abstract

View articletitled, Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging

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Topics: Packaging , Stress analysis (Engineering) , Pressure , Blocks (Building materials) , Circuits , Design , Electronic systems , Manufacturing , Metals , Plates (structures)

Stress Relief in Solder Joints Due to the Application of a Flex Circuit

E. Suhir

J. Electron. Packag. September 1991, 113(3): 240–243. doi: https://doi.org/10.1115/1.2905401

Abstract

View articletitled, Stress Relief in Solder Joints Due to the Application of a Flex Circuit

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Topics: Flexible electronics , Solder joints , Stress , Buckling , Design , Fatigue life , Stress analysis (Engineering) , Thermal expansion

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

Tin-Lup Wong, Karl K. Stevens, Gang Wang

J. Electron. Packag. September 1991, 113(3): 244–249. doi: https://doi.org/10.1115/1.2905402

Abstract

View articletitled, Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

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Topics: Dynamic models , Dynamic response , Electronic components , Lumber , Modal analysis , Mode shapes , Structural dynamics , Surface mount components , Surface mount packaging , Testing

The "Smeared" Property Technique for the FE Vibration Analysis of Printed Circuit Cards

J. M. Pitarresi, D. V. Caletka, R. Caldwell, D. E. Smith

J. Electron. Packag. September 1991, 113(3): 250–257. doi: https://doi.org/10.1115/1.2905403

Abstract

View articletitled, The "Smeared" Property Technique for the FE Vibration Analysis of Printed Circuit Cards

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Topics: Approximation , Boundary-value problems , Circuits , Finite element analysis , Finite element model , Mechanical properties , Modal assurance criterion , Mode shapes , Printed circuit boards , Surface mount technology

Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

J. G. Stack, M. S. Acarlar

J. Electron. Packag. September 1991, 113(3): 258–262. doi: https://doi.org/10.1115/1.2905404

Abstract

View articletitled, Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

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Topics: Energy dissipation , Finite element analysis , Heat transfer , Military systems , Packaging , Reliability , Stress , Temperature , Thermal management , Thermal stresses

Reliability Monitoring in Drilling Electronic Circuit Boards

H. Hocheng, C. L. Jiaa

J. Electron. Packag. September 1991, 113(3): 263–267. doi: https://doi.org/10.1115/1.2905405

Abstract

View articletitled, Reliability Monitoring in Drilling Electronic Circuit Boards

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Topics: Drilling , Printed circuit boards , Reliability , Delamination , Acoustic emissions , Composite materials , Damage , Energy levels (Quantum mechanics) , Manufacturing , Mechanical structures

Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

G. Refai Ahmed, M. M. Yovanovich

J. Electron. Packag. September 1991, 113(3): 268–274. doi: https://doi.org/10.1115/1.2905406

Abstract

View articletitled, Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

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Topics: Heat , Heat transfer , Natural convection , Heat conduction , Rayleigh number , Thermal conductivity

A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics

Jun Ming Hu, Michael Pecht, Abhijit Dasgupta

J. Electron. Packag. September 1991, 113(3): 275–285. doi: https://doi.org/10.1115/1.2905407

Abstract

View articletitled, A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics

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Topics: Fatigue life , Microelectronic devices , Wire bonding , Wire , Fatigue failure , Reliability , Stress , Temperature , Uncertainty , Bonding

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

S. Heng, W. Z. Black

J. Electron. Packag. September 1991, 113(3): 286–293. doi: https://doi.org/10.1115/1.2905408

Abstract

View articletitled, Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

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Topics: Temperature , Emissivity , Image processing , Temperature measurement , Computer software , Computers , Hardware , Heat flux , Infrared imaging , Overlays (Materials engineering)

Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

Ching Jen Chen, Ramiro H. Bravo

J. Electron. Packag. September 1991, 113(3): 294–300. doi: https://doi.org/10.1115/1.2905409

Abstract

View articletitled, Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

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Topics: Channel flow , Heat transfer , Heat exchangers , Flow (Dynamics) , Separation (Technology) , Temperature , Computation , Fluid dynamics , Fluids , Numerical analysis

Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure

R. J. Krane, T. J. Phillips

J. Electron. Packag. September 1991, 113(3): 301–308. doi: https://doi.org/10.1115/1.2905410

Abstract

View articletitled, Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure

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Topics: Cooling , Natural convection , Electronic components , Geometry , Heat flux , Heat transfer , Rayleigh number , Temperature

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Y. Chin, C. F. Ma, X. Q. Gu, L. Xu

J. Electron. Packag. September 1991, 113(3): 309–312. doi: https://doi.org/10.1115/1.2905411

Abstract

View articletitled, Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

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Topics: Convection , Flow (Dynamics) , Integrated circuits , Heat transfer , Buoyancy , Forced convection , Mixed convection , Rayleigh number , Reynolds number

Optimal Thermal Design of Forced Convection Heat Sinks-Analytical

R. W. Knight, J. S. Goodling, D. J. Hall

J. Electron. Packag. September 1991, 113(3): 313–321. doi: https://doi.org/10.1115/1.2905412

Abstract

View articletitled, Optimal Thermal Design of Forced Convection Heat Sinks-Analytical

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Topics: Design , Forced convection , Heat , Coolants , Cooling , Dimensions , Optimization , Thermal resistance , Copper , Flow (Dynamics)

Technical Briefs

Statistical Energy Analysis for Electronic Equipment

L. Lu

J. Electron. Packag. September 1991, 113(3): 322–325. doi: https://doi.org/10.1115/1.2905413

Abstract

View articletitled, Statistical Energy Analysis for Electronic Equipment

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Topics: Electronic equipment , Seas , Vibration , Finite element model , Instrumentation , Vibration analysis

Analysis of Transient State Temperature Distribution in the Thyristor Packaging

A. Skorek, A. J. Jordan, V. Rajagopalan

J. Electron. Packag. September 1991, 113(3): 325–328. doi: https://doi.org/10.1115/1.2905414

Abstract

View articletitled, Analysis of Transient State Temperature Distribution in the Thyristor Packaging

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Topics: Packaging , Temperature distribution , Transients (Dynamics) , Finite element methods , Electronics , Simulation , Thermocouples

Book Reviews

The Finite Element in Thermomechanics

Tai-Ran Hsu, Author, J. H. Lau, Reviewer

J. Electron. Packag. September 1991, 113(3): 329. doi: https://doi.org/10.1115/1.2905415

View articletitled, <em>The Finite Element in Thermomechanics</em>

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Topics: Finite element analysis , Thermomechanics

Research Papers

Piezoresistive Stress Sensors for Structural Analysis of Electronic Packages

A Fundamental Study of the Tape Automated Bonding Process

Stress Analyses of Flip TAB Interconnects in Multi-Chip Module Assembly

Stress Analysis of the Vertical Interconnect for Three-Dimensional Packaging

Stress Relief in Solder Joints Due to the Application of a Flex Circuit

Experimental Modal Analysis and Dynamic Response Prediction of PC Boards With Surface Mount Electronic Components

The "Smeared" Property Technique for the FE Vibration Analysis of Printed Circuit Cards

Heat Transfer and Thermal Stress Analysis of an Optoelectronic Package

Reliability Monitoring in Drilling Electronic Circuit Boards

Influence of Discrete Heat Source Location on Natural Convection Heat Transfer in a Vertical Square Enclosure

A Probabilistic Approach for Predicting Thermal Fatigue Life of Wire Bonding in Microelectronics

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

Heat Transfer Study of Staggered Thin Rectangular Blocks in a Channel Flow

Natural Convection Cooling of a Horizontally Oriented Component Board Mounted in a Low-Aspect-Ratio Enclosure

Mixed Convective Heat Transfer From a Simulated Microchip to Liquid Flows in a Horizontal Rectangular Channel

Optimal Thermal Design of Forced Convection Heat Sinks-Analytical

Technical Briefs

Statistical Energy Analysis for Electronic Equipment

Analysis of Transient State Temperature Distribution in the Thyristor Packaging

Book Reviews

The Finite Element in Thermomechanics

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