Topics: Fatigue properties , Microelectronic devices , Solder joints , Shear (Mechanics) , Tin , Vehicles , Computers , Design , Engineering prototypes , Failure

Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

H. D. Solomon

J. Electron. Packag. June 1991, 113(2): 102–108. doi: https://doi.org/10.1115/1.2905374

Abstract

View articletitled, Low Cycle Fatigue of Sn96 Solder With Reference to Eutectic Solder and a High Pb Solder

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Topics: Low cycle fatigue , Solders , Tin , Melting point , Silver , Temperature , Ductility , Fatigue , Fatigue life , Soldering

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Z. Mei, J. W. Morris, Jr., M. C. Shine

J. Electron. Packag. June 1991, 113(2): 109–114. doi: https://doi.org/10.1115/1.2905375

Abstract

View articletitled, Superplastic Creep of Eutectic Tin-Lead Solder Joints

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Topics: Creep , Solder joints , Superplasticity , Stress , Cooling , Dislocations , Grain boundaries , Nitrogen , Recrystallization , Steady state

Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

J. K. Tien, B. C. Hendrix, A. I. Attarwala

J. Electron. Packag. June 1991, 113(2): 115–120. doi: https://doi.org/10.1115/1.2905376

Abstract

View articletitled, Understanding the Cyclic Mechanical Behavior of Lead/Tin Solder

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Topics: Mechanical behavior , Solders , Creep , Stress , Temperature , Damage , Deformation , Storage , Testing

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

R. G. Ross, Jr.

J. Electron. Packag. June 1991, 113(2): 121–128. doi: https://doi.org/10.1115/1.2905377

Abstract

View articletitled, A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

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Topics: Electronic packaging , Fatigue , Solder joints , Space vehicles , Cycles , Hardware , Failure , Flight , Solders , Design

Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

P. A. Engel, D. V. Caletka, M. R. Palmer

J. Electron. Packag. June 1991, 113(2): 129–137. doi: https://doi.org/10.1115/1.2905378

Abstract

View articletitled, Stiffness and Fatigue Study for Surface Mounted Module/Lead/Card Systems

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Topics: Fatigue , Stiffness , Circuits , Stress , Bending (Stress) , Computation , Die cutting , Failure , Fatigue strength , Fatigue testing

Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

J. Lau, R. Subrahmanyan, D. Rice, S. Erasmus, C. Li

J. Electron. Packag. June 1991, 113(2): 138–148. doi: https://doi.org/10.1115/1.2905379

Abstract

View articletitled, Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

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Topics: Ceramics , Epoxy adhesives , Epoxy resins , Fatigue analysis , Copper , Solder joints , Thermal expansion , Fatigue , Reliability , Solders

Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

D. Barker, M. Pecht, A. Dasgupta, S. Naqvi

J. Electron. Packag. June 1991, 113(2): 149–155. doi: https://doi.org/10.1115/1.2905380

Abstract

View articletitled, Transient Thermal Stress Analysis of a Plated Through Hole Subjected to Wave Soldering

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Topics: Thermal stresses , Transients (Dynamics) , Wave soldering , Stress , Temperature , Anisotropy , Damage , Fatigue life , Fracture (Materials) , Heat transfer

Thermal Analysis of Surface Mounted Leadless Chip Carriers

W. T. Cooley, A. Razani

J. Electron. Packag. June 1991, 113(2): 156–163. doi: https://doi.org/10.1115/1.2905381

Abstract

View articletitled, Thermal Analysis of Surface Mounted Leadless Chip Carriers

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Topics: Thermal analysis , Design , Heat transfer , Thermal characterization , Computers , Finite element analysis , Geometry , Heat transfer coefficients , Junctions , Microelectronic devices

Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

Yi-Hsin Pao, Ellen Eisele

J. Electron. Packag. June 1991, 113(2): 164–172. doi: https://doi.org/10.1115/1.2905382

Abstract

View articletitled, Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading

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Topics: Shear (Mechanics) , Stress , Solder joints , Deflection , Differential equations , Dimensions , Materials properties , Shear stress , Temperature , Temperature controls

Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips

Mikyoung Lee, I. Jasiuk

J. Electron. Packag. June 1991, 113(2): 173–177. doi: https://doi.org/10.1115/1.2905383

Abstract

View articletitled, Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips

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Topics: Strips , Thermal stresses , Stress , Elasticity , Temperature

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

D. T. Read, G. K. Lucey, Jr.

J. Electron. Packag. June 1991, 113(2): 178–185. doi: https://doi.org/10.1115/1.2905384

Abstract

View articletitled, Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

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Topics: Finite element analysis , Mesh generation , Solder joints , Surface mount technology , X-rays , Computer software , Failure , Inspection , Machinery , Modeling

Technical Briefs

The Solder Joint Fatigue Life Acceleration Factor

H. D. Solomon

J. Electron. Packag. June 1991, 113(2): 186–190. doi: https://doi.org/10.1115/1.2905385

View articletitled, The Solder Joint Fatigue Life Acceleration Factor

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Topics: Fatigue life , Solder joints

A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data

S. J. Russell

J. Electron. Packag. June 1991, 113(2): 190–193. doi: https://doi.org/10.1115/1.2905386

Abstract

View articletitled, A Creep/Relaxation Model Which Exhibits Chaotic Instability—Comparison With Solder Data

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Topics: Aeroelasticity , Solders , Stress , Chaos , Grain size , Steady state , Creep , Dynamics (Mechanics) , Fatigue , Relaxation (Physics)

Fatigue Analysis of a Planarpak™ Surface Mount Component

I. Sharif, D. B. Barker, A. Dasgupta, M. G. Pecht

J. Electron. Packag. June 1991, 113(2): 194–199. doi: https://doi.org/10.1115/1.2905387

Abstract

View articletitled, Fatigue Analysis of a Planarpak™ Surface Mount Component

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Topics: Bonding , Fatigue analysis , Fatigue life , Finite element model , Printed circuit boards , Solders , Stress , Surface mount components , Surface mount devices , Thermal stresses