Rapid advancement of modern electronics has pushed the limits of traditional thermal management techniques. Novel approaches to the manipulation of the flow of heat in electronic systems have potential to open new design spaces. Here, the field of thermal metamaterials as it applies to electronics is briefly reviewed. Recent research and development of thermal metamaterial systems with anisotropic thermal conductivity for the manipulation of heat flow in ultra-thin composites is explained. An explanation of fundamental experimental studies on heat flow control using standard printed circuit board (PCB) technology follows. From this, basic building blocks for heat flux cloaking, focusing, and reversal are reviewed, and their extension to a variety of electronics applications is emphasized. While device temperature control, thermal energy harvesting, and electrothermal circuit design are the primary focus, some discussion on the extension of thermal guiding (TG) structures to device-scale applications is provided. In total, a holistic view is offered of the myriad of possible applications of thermal metamaterials to heat flow control in future electronics.
Issue Section:
Special Section Papers
References
1.
Pendry
, J. B.
, Schurig
, D.
, and Smith
, D. R.
, 2006
, “Controlling Electromagnetic Fields
,” Science
, 312
(5781), pp. 1780
–1782
.2.
Leonhardt
, U.
, 2006
, “Optical Conformal Mapping
,” Science
, 312
(5781), pp. 1777
–1780
.3.
Schurig
, D.
, Mock
, J. J.
, Justice
, B. J.
, Cummer
, S. A.
, Pendry
, J. B.
, Starr
, A. F.
, and Smith
, D. R.
, 2006
, “Metamaterial Electromagnetic Cloak at Microwave Frequencies
,” Science
, 314
(5801), pp. 977
–980
.4.
Fan
, C. Z.
, Gao
, Y.
, and Huang
, J. P.
, 2008
, “Shaped Graded Materials With an Apparent Negative Thermal Conductivity
,” Appl. Phys. Lett.
, 92
(25
), p. 251907
.5.
Chen
, T.
, Weng
, C.
, and Chen
, J.
, 2008
, “Cloak for Curvilinearly Anisotropic Media in Conduction
,” Appl. Phys. Lett.
, 93
(11
), p. 114103
.6.
Li
, J. Y.
, Gao
, Y.
, and Huang
, J. P.
, 2010
, “A Bifunctional Cloak Using Transformation Media
,” J. Appl. Phys.
, 108
(7
), p. 074504
.7.
Guenneau
, S.
, Amra
, C.
, and Veynante
, D.
, 2012
, “Transformation Thermodynamics: Cloaking and Concentrating Heat Flux
,” Opt. Express
, 20
(7
), pp. 8207
–8218
.8.
Guenneau
, S.
, and Amra
, C.
, 2016
, “Anisotropic Conductivity Rotates Heat Fluxes in Transient Regimes
,” Opt. Express
, 21
(5
), pp. 6578
–6583
.9.
Narayana
, S.
, and Sato
, Y.
, 2012
, “Heat Flux Manipulation With Engineered Thermal Materials
,” Phys. Rev. Lett.
, 108
, p. 214303
.10.
Schittny
, R.
, Kadic
, M.
, Guenneau
, S.
, and Wegener
, M.
, 2013
, “Experiments on Transformation Thermodynamics: Molding the Flow of Heat
,” Phys. Rev. Lett.
, 110
, p. 195901
.11.
Dede
, E. M.
, Nomura
, T.
, Schmalenberg
, P.
, and Lee
, J. S.
, 2013
, “Heat Flux Cloaking, Focusing, and Reversal in Ultra-Thin Composites Considering Conduction-Convection Effects
,” Appl. Phys. Lett.
, 103
(6
), p. 063501
.12.
Dede
, E. M.
, 2010
, “Simulation and Optimization of Heat Flow Via Anisotropic Material Thermal Conductivity
,” Comput. Mater. Sci.
, 50
(2
), pp. 510
–515
.13.
Farhat
, M.
, Chen
, P.-Y.
, Bagci
, H.
, Amra
, C.
, Guenneau
, S.
, and Alu
, A.
, 2015
, “Thermal Invisibility Based on Scattering Cancellation and Mantle Cloaking
,” Sci. Rep.
, 5
, p. 9876
.14.
Dede
, E. M.
, Nomura
, T.
, and Lee
, J.
, 2014
, “Thermal-Composite Design Optimization for Heat Flux Shielding, Focusing, and Reversal
,” Struct. Multidiscipl. Optim.
, 49
(1
), pp. 59
–68
.15.
Vemuri
, K. P.
, Canbazoglu
, F. M.
, and Bandaru
, P. R.
, 2014
, “Guiding Conductive Heat Flux Through Thermal Metamaterials
,” Appl. Phys. Lett.
, 105
(19
), p. 193904
.16.
Han
, T.
, Bai
, X.
, Liu
, D.
, Gao
, D.
, Li
, B.
, Thong
, J. T. L.
, and Qiu
, C.-W.
, 2015
, “Manipulating Steady Heat Conduction by Sensu-Shaped Thermal Metamaterials
,” Sci. Rep.
, 5
, p. 10242
.17.
Chen
, F.
, and Lei
, D. Y.
, 2015
, “Experimental Realization of Extreme Heat Flux Concentration With Easy-to-Make Thermal Metamaterials
,” Sci. Rep.
, 5
, p. 11552
.18.
Xu
, H.
, Shi
, X.
, Gao
, F.
, Sun
, H.
, and Zhang
, B.
, 2014
, “Ultrathin Three-Dimensional Thermal Cloak
,” Phys. Rev. Lett.
, 112
, p. 054301
.19.
Moccia
, M.
, Castaldi
, G.
, Savo
, S.
, Sato
, Y.
, and Galdi
, V.
, 2014
, “Independent Manipulation of Heat and Electrical Current Via Bifunctional Metamaterials
,” Phys. Rev. X
, 4
, p. 021025
.20.
Ma
, Y.
, Liu
, Y.
, Raza
, M.
, Wang
, Y.
, and He
, S.
, 2014
, “Experimental Demonstration of a Multiphysics Cloak: Manipulating Heat Flux and Electric Current Simultaneously
,” Phys. Rev. Lett.
, 113
, p. 205501
.21.
Han
, T.
, Bai
, X.
, Thong
, J. T. L.
, Li
, B.
, and Qiu
, C.-W.
, 2014
, “Full Control and Manipulation of Heat Signatures: Cloaking, Camouflage and Thermal Metamaterials
,” Adv. Mater.
, 26
(11
), pp. 1731
–1734
.22.
Nguyen
, D. M.
, Xu
, H.
, Zhang
, Y.
, and Zhang
, B.
, 2015
, “Active Thermal Cloak
,” Appl. Phys. Lett.
, 107
(12
), p. 121901
.23.
Li
, Y.
, Shen
, X.
, Wu
, Z.
, Huang
, J.
, Chen
, Y.
, Ni
, Y.
, and Huang
, J.
, 2015
, “Temperature-Dependent Transformation Thermotics: From Switchable Thermal Cloaks to Macroscopic Thermal Diodes
,” Phys. Rev. Lett.
, 115
, p. 195503
.24.
Langer
, G.
, Leitgeb
, M.
, Nicolics
, J.
, Unger
, M.
, Hoschopf
, H.
, and Wenzl
, F. P.
, 2014
, “Advanced Thermal Management Solutions on PCBs for High Power Applications
,” IPC Association Connecting Electronics Industries Expo
, Las Vegas, NV, March 25–27, pp. 1
–15
.25.
Saums
, D. L.
, and Hay
, R. A.
, 2014
, “Developments for Copper-Graphite Composite Thermal Cores for PCBs for High-Reliability RF Systems
,” 8th International Conference Integer Power System
(CIPS
), Nuremberg, Germany, Feb. 25–27, pp. 1
–6
.26.
Wits
, W. W.
, and Vaneker
, T. H. J.
, 2010
, “Integrated Design and Manufacturing of Flat Miniature Heat Pipes Using Printed Circuit Board Technology
,” IEEE Trans. Compon. Packag. Technol.
, 33
(2
), pp. 398
–408
.27.
Botau
, A.
, and Negrea
, C.
, 2013
, “PCB Layout Optimization for LED Backlight Module Using FEM Simulation
,” IEEE 19th International Symposium for Design and Technology in Electronic Packaging
(SIITME
), Galati, Romania, Oct. 24–27, pp. 125
–128.
28.
Dede
, E. M.
, Schmalenberg
, P.
, Nomura
, T.
, and Ishigaki
, M.
, 2015
, “Design of Anisotropic Thermal Conductivity in Multilayer Printed Circuit Boards
,” IEEE Trans. Compon. Pack. Manuf. Technol.
, 5
(12
), pp. 1763
–1774
.29.
Dede
, E. M.
, Schmalenberg
, P.
, Wang
, C.-M.
, Zhou
, F.
, and Nomura
, T.
, 2016
, “Collection of Low-Grade Waste Heat for Enhanced Energy Harvesting
,” AIP Adv.
, 6
(5
), p. 055113
.30.
Loke
, D.
, Skelton
, J. M.
, Chong
, T.-C.
, and Elliott
, S. R.
, 2016
, “Design of a Nanoscale, CMOS-Integrable, Thermal-Guiding Structure for Boolean-Logic and Neuromorphic Computation
,” ACS Appl. Mater. Interfaces
, 8
(50
), pp. 34530
–34536
.31.
Özişik
, M. N.
, 1993
, Heat Conduction
, 2nd ed., Wiley
, New York
.32.
Hatta
, H.
, and Taya
, M.
, 1986
, “Equivalent Inclusion Method for Steady State Heat Conduction in Composites
,” Int. J. Eng. Sci.
, 24
(7
), pp. 1159
–1172
.33.
Hasselman
, D. P. H.
, Bhatt
, H.
, Donaldson
, K. Y.
, and Thomas
, J. R.
, 1992
, “Effect of Fiber Orientation and Sample Geometry on the Effective Thermal Conductivity of a Uniaxial Carbon Fiber Reinforced Glass Matrix Composite
,” J. Compos. Mater.
, 26
(15
), pp. 2278
–2288
.34.
Hull
, D.
, and Clyne
, T. W.
, 1996
, An Introduction to Composite Materials
, 2nd ed., Cambridge University Press
, Cambridge, UK
.35.
Kawamoto
, A.
, Matsumori
, T.
, Yamasaki
, S.
, Nomura
, T.
, Kondoh
, T.
, and Nishiwaki
, S.
, 2011
, “Heaviside Projection Based Topology Optimization by a PDE-Filtered Scalar Function
,” Struct. Multidiscip. Optim.
, 44
(1
), pp. 19
–24
.36.
COMSOL AB,
2008
, “COMSOL Multiphysics Ver. 3.5a
,” Stockholm, Sweden.37.
Svanberg
, K.
, 1987
, “The Method of Moving Asymptotes—A New Method for Structural Optimization
,” Int. J. Numer. Methods Eng.
, 24
(2
), pp. 359
–373
.38.
He
, X.
, and Wu
, L.
, 2013
, “Design of Two-Dimensional Open Cloaks With Finite Material Parameters for Thermodynamics
,” Appl. Phys. Lett.
, 102
(21
), p. 211912
.39.
Min
, G.
, and Rowe
, D. M.
, 1992
, “Optimisation of Thermoelectric Module Geometry for ‘Waste Heat’ Electric Power Generation
,” J. Power Sources
, 38
(3
), pp. 253
–259
.40.
Dede
, E. M.
, Wang
, C.-M.
, Liu
, Y.
, Schmalenberg
, P.
, Zhou
, F.
, Shin
, J.-W.
, and Ishigaki
, M.
, 2017, “Electrothermal Circuit Design With Heat Flow Control—Synchronous Buck Converter Case Study
,” IEEE Trans. Compon. Pack. Manuf. Technol.
(in press).41.
TI
, 2016
, “High Power Density Voltage Regulator Module for CPU Core Power in Enterprise Switching,” Texas Instruments Inc., Dallas, TX, accessed Jan. 23, 2018, http://www.ti.com/tool/PMP793542.
43.
Lohan
, D. J.
, Allison
, J. T.
, Dede
, E. M.
, and Ishigaki
, M.
, 2016
, “Combined Lumped and Continuum Parameter Design Optimization of Electro-Thermal Systems,” ASME
Paper No. DETC2016-60218. 44.
Petrovic
, M.
, Nomura
, T.
, Yamada
, T.
, Izui
, K.
, and Nishiwaki
, S.
, “Orthotropic Material Orientation Optimization Method in Composite Laminates
,” Struct. Multidiscip. Optim.
(epub).45.
Nomura
, T.
, 2016
, “Structural Thermodynamics With Topology Optimization
,” accessed Jan. 23, 2018, http://www.idtechex.com/electric-vehicles-usa-16/show/en/speakers/9317/structural-thermodynamics-with-topology-optimization46.
Nishiwaki
, S.
, 2017
, “Development of Conceptual Design Methods Based on Topology Optimization
,” JSDE Des. Eng.
, 52
(7
), pp. 439
–444
.47.
Yu
, J.-K.
, Mitrovic
, S.
, Tham
, D.
, Varghese
, J.
, and Heath
, J. R.
, 2010
, “Reduction of Thermal Conductivity in Phononic Nanomesh Structures
,” Nat. Nanotechnol.
, 5
, pp. 718
–721
.48.
Park
, W.
, Romano
, G.
, Ahn
, E. C.
, Kodama
, T.
, Park
, J.
, Barako
, M. T.
, Sohn
, J.
, Kim
, S. J.
, Cho
, J.
, Marconnet
, A. M.
, Asheghi
, M.
, Kolpak
, A. M.
, and Goodson
, K. E.
, 2017
, “Phonon Conduction in Silicon Nanobeam Labyrinths
,” Sci. Rep.
, 7
, p. 6233
.49.
Lei
, S.
, Alexandre
, S.
, and Enright
, E.
, 2017
, “Thermo-Optic Tuning Efficiency of Micro Ring Resonators on Low Thermal Resistance Silicon Photonics Substrates,” ASME
Paper No. IPACK2017-74181. 50.
Markus
, S.
, Maier
, J.
, Scheer
, E.
, and Leiderer
, P.
, 2011
, “A Thermal Diode Using Phonon Rectification
,” New J. Phys.
, 13
(11
), p. 113027
.51.
Yang
, N.
, Zhang
, G.
, and Li
, B.
, 2008
, “Carbon Nanocone: A Promising Thermal Rectifier
,” Appl. Phys. Lett.
, 93
(24
), p. 243111
.52.
Pop
, E.
, 2010
, “Energy Dissipation and Transport in Nanoscale Devices
,” Nano Res.
, 3
(3
), pp. 147
–169
.53.
Han
, H.
, Zhang
, Y.
, Wang
, N.
, Samani
, M. K.
, Ni
, Y.
, Mijbil
, Z. Y.
, Edwards
, M.
, Xiong
, S.
, Saaskilahti
, K.
, Murugesan
, M.
, Fu
, Y.
, Ye
, L.
, Sadeghi
, H.
, Bailey
, S.
, Kosevich
, Y. A.
, Lambert
, C. J.
, Liu
, J.
, and Volz
, S.
, 2016
, “Functionalization Mediates Heat Transport in Graphene Nanoflakes
,” Nat. Commun.
, 7
, p. 11281
.54.
Wang
, L.
, and Li
, B.
, 2007
, “Thermal Logic Gates: Computation With Phonons
,” Phys. Rev. Lett.
, 99
, p. 177208
.Copyright © 2018 by ASME
You do not currently have access to this content.
