The trend toward 3D integration in electronic packaging requires that failure analysis procedures and target preparation methods are adapted from conventional discrete packages to these emerging packaging technologies. This paper addresses the feasibility of laser-based target preparation in 3D integrated devices, especially stacked-die packages. Various laser technologies such as ultrashort-pulse lasers, excimer lasers, and diode-pumped solid-state (DPSS) lasers with different wavelengths and pulse durations were evaluated. In particular, it was found that ultrashort-pulse lasers with pulse durations in the femtosecond range were not suitable for ablation of the molding compound (MC). Picosecond lasers were applicable with certain constraints. It was found that for MCs with high filler content, DPSS lasers with pulse durations in the nanosecond range were the best choice. For the removal of stacked silicon dies, the laser wavelength was the most important factor in artifact-free thinning. Laser cross sections through several silicon dies with remarkably small heat-affected zones were also demonstrated. The distinct removal of the MC, silicon dies, and metal interconnected with a single laser source offers new opportunities for laser-based target preparation in 3D integrated electronic packaging devices.
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September 2009
Research Papers
Laser-Based Target Preparation in 3D Integrated Electronic Packages
Stefan Martens,
Stefan Martens
Infineon Technologies AG
, 93049 Regensburg, Germany
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Walter Mack,
Walter Mack
Infineon Technologies AG
, 93049 Regensburg, Germany
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Frédéric Courtade,
Frédéric Courtade
Centre National d’Etudes Spatiales, CNES
, 31401 Toulouse, France
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Philippe Perdu,
Philippe Perdu
Centre National d’Etudes Spatiales, CNES
, 31401 Toulouse, France
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Juergen Wilde,
Juergen Wilde
Department of Microsystems Engineering (IMTEK), Laboratory for Assembly and Packaging,
University of Freiburg
, 79110 Freiburg, Germany
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Friedemann Voelklein
Friedemann Voelklein
Institute of Microtechnologies, IMtech,
University of Applied Sciences Wiesbaden
, 65197 Wiesbaden, Germany
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Stefan Martens
Infineon Technologies AG
, 93049 Regensburg, Germany
Walter Mack
Infineon Technologies AG
, 93049 Regensburg, Germany
Frédéric Courtade
Centre National d’Etudes Spatiales, CNES
, 31401 Toulouse, France
Philippe Perdu
Centre National d’Etudes Spatiales, CNES
, 31401 Toulouse, France
Juergen Wilde
Department of Microsystems Engineering (IMTEK), Laboratory for Assembly and Packaging,
University of Freiburg
, 79110 Freiburg, Germany
Friedemann Voelklein
Institute of Microtechnologies, IMtech,
University of Applied Sciences Wiesbaden
, 65197 Wiesbaden, GermanyJ. Electron. Packag. Sep 2009, 131(3): 031006 (6 pages)
Published Online: June 23, 2009
Article history
Received:
December 2, 2008
Revised:
April 22, 2009
Published:
June 23, 2009
Citation
Martens, S., Mack, W., Courtade, F., Perdu, P., Wilde, J., and Voelklein, F. (June 23, 2009). "Laser-Based Target Preparation in 3D Integrated Electronic Packages." ASME. J. Electron. Packag. September 2009; 131(3): 031006. https://doi.org/10.1115/1.3144157
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