Wax (predominantly tricosane paraffin wax, with a melting temperature of ) filled with hexagonal boron nitride (BN) particles was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured with the interface material between copper surfaces, decreased with increasing temperature from , but increased with increasing temperature from . The melting of the wax enhanced the conductance, due to increased conformability to the mating surfaces. For a given BN volume fraction and a given temperature, the thermal contact conductance increased with increasing contact pressure. However, a pressure above resulted in no significant increase in the conductance. The conductance increased with BN content up to , but decreased upon further increase to . The highest conductance above the melting temperature was , as attained for a BN content of at and . Below the melting temperature, the highest conductance was , as attained for a BN content of at and .
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December 2006
Research Papers
Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material
Zongrong Liu,
Zongrong Liu
Composite Materials Research Laboratory, University at Buffalo,
The State University of New York
, Buffalo, NY 14260-4400
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D. D. L. Chung
D. D. L. Chung
Composite Materials Research Laboratory, University at Buffalo,
The State University of New York
, Buffalo, NY 14260-4400
Search for other works by this author on:
Zongrong Liu
Composite Materials Research Laboratory, University at Buffalo,
The State University of New York
, Buffalo, NY 14260-4400
D. D. L. Chung
Composite Materials Research Laboratory, University at Buffalo,
The State University of New York
, Buffalo, NY 14260-4400J. Electron. Packag. Dec 2006, 128(4): 319-323 (5 pages)
Published Online: June 1, 2006
Article history
Received:
April 21, 2004
Revised:
June 1, 2006
Citation
Liu, Z., and Chung, D. D. L. (June 1, 2006). "Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material." ASME. J. Electron. Packag. December 2006; 128(4): 319–323. https://doi.org/10.1115/1.2351895
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