System-in-a-Package (SiP) aims to integrate the entire system functions within a system-level package containing multiple ICs and other components interconnected in a high-density substrate. A structure based on the SiP concept is proposed in this paper. Based on this SiP structure, four substrate candidates, namely FR4, liquid crystal polymer (LCP), teflon (PTFE) and low temperature co-fired ceramic (LTCC) were compared by assessing and measuring their mechanical reliability, electrical performance and environmental influence. First, to evaluate long-term reliability, the 3D finite element method (FEM) was used to calculate the stress distribution and warpage of the whole package. Both three-point bending and cooling in the manufacturing process were taken into consideration. The LCP has a coefficient of thermal expansion (CTE) close to that of the silicon chip, and a Young’s module close to that of FR4, which gave the best reliability in both bending and cooling situations. Next, the dielectric constants and the loss tangent for the four substrates were evaluated in the electrical performance investigation. The LCP has a low relative dielectric constant and a low dissipation factor for the frequency range 1 GHz to 35 GHz, making it a good substrate for high frequency applications. An environmental assessment included several environmental impact categories; this assessment indicated that LCP is the most environmentally acceptable substrate.
Issue Section:
Technical Papers
Keywords:
packaging,
design for environment,
environmental degradation,
dielectric losses,
Young's modulus,
bending,
thermal expansion,
finite element analysis,
permittivity,
reliability
Topics:
Ceramics,
Cooling,
Density,
Epoxy resins,
Finite element methods,
Manufacturing,
Microwaves,
Reliability,
System-in-package,
Thermal expansion,
Warping,
Energy dissipation,
Liquid crystalline polymers,
Silicon chips,
Deformation,
Copper,
Design,
Low temperature,
Stress concentration,
Transfer functions,
Young's modulus,
Stress,
Electrical properties,
Packaging
1.
Tummala
, R.
, and Madisetti
, V. K.
, 1999
, “System on Chip or System on Package?
” IEEE Design & Test of Computers
, April–June 1999, pp. 48
–56
.2.
Davidson, E., 2001, “SoC or SoP? A Balanced Approach!” Proc. 51st Electronic Components and Technology Conference, pp. 529–534.
3.
Tai, K. L., 2000, “System-in-Package (SIP): Challenges and Opportunities,” Proceedings of Asia and South Pacific Design Automation Conference, (the ASP-DAC 2000), pp. 191–196.
4.
Vardaman, E. J., 2000, “Low Cost Options for Next Generation Packaging,” Proceedings 50th Electronic Components and Technology Conference, pp. 457–458.
5.
Tro¨ster
, G.
, 1998
, “New Route in System Integration: Chip-Package Codesign
,” Micro, IEEE
, 18
(4
), pp. 7
–9
.6.
Fillion
, R. A.
, Wojnarowski
, R. J.
, Gorcyzca
, T. B.
, Wildi
, E. J.
, and Cole
, H. S.
, 1995
, “Development of a Plastic Encapsulated Multchip Technology for High Volume, Low Cost Commercial Electronics
,” IEEE Transaction on CPMT, Part B
, 18
(1
), pp. 59
–65
.7.
Tuominen, R., and Kivilahti, J. K., 2000, “A Novel IMB Technology for Integrating Active and Passive Components,” Adhesive Joining and Coating Technology in Electronic Manufacturing, Proceedings of 4th International Conference on Adhesives in Electronics, pp. 269–273.
8.
Kujala, A., Tuominen, R., and Kivilahti, J. K., 1999, “Solderless Interconnection and Packaging Technique for Embedded Active Components,” Electronic Components and Technology Conference, pp. 155–159.
9.
Zhou, J., Wang, X., Chen, L., and Liu, J., 2001, “Modeling of Heat Transfer for System In a Package (SIP),” Proceedings of EuroSIME/2001, Paris, France, April 9–11, pp. 89–94.
10.
Zou, G., Gro¨nqvist, H., Starski, P., and Liu, J., 2002, “High Frequency Characteristics of Liquid Crystal Polymer for System in a Package Application,” 8th International Symposium on Advanced Packaging Materials, March 3–6, Atlanta, Georgia, pp. 337–341.
11.
Chen
, L.
, Crnic
, M.
, Lai
, Z.
, and Liu
, J.
, 2002
, “Process Development and Adhesion Behavior of Electroless Copper on Liquid Crystal Polymer (LCP) for Electronic Packaging Application
,” IEEE Transactions on Electronics Packaging Manufacturing
, 25
(4
), pp. 273
–278
.12.
Laverghetta, T. S., 2000, Microwave Materials and Fabrication Techniques, Third Edition, Artech House 2000.
13.
Aguilar, J. R., et al., 1998, “The Microwave and RF Characterization of FR4 Substrates,” IEE Colloquium on Low Cost Antenna Technology, pp. 2/1–2/6.
14.
Santhanam, N., 1999, “Low Cost, High Performance RF Substrate,” IEEE MTT-S Symposium on Technologies for Wireless Applications, Digest 1999, pp. 65–68.
15.
Devlin, L., et al., 2000, “LTCC for RF Modules,” IEE Seminar, Packaging and Interconnects at Microwave and mm-Wave Frequencies.
16.
Goedkoop, M., and Spriensma, R., 2000, “The Eco-indicator 99: A Damage Oriented Method for Life Cycle Impact Assessment, Methodology Report,” see http://www.pre.nl, accessed 2002-10-01. pp. 113–119.
17.
Steen, B., 2001, “Identification of Significant Environmental Aspects and Their Indicators,” Environmental Systems Analysis, Chalmers University of Technology, Gothenburg, Sweden, CPM report 2001:7, pp. 27.
18.
Griese, H-J., et al., 2001, “Green Polytronics,” Proceedings of First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics.
19.
Middendorf, A., et al., 2000, “EE-Toolbox-a Modular Assessment System for the Environmental Optimization of Electronics,” Proceedings of IEEE International Symposium on Electronics and the Environment, pp. 166–171.
20.
Stobbe, I., “TPI-Calculator for download,” Fraunhofer Institut for Zuverla¨ssigkeit and Mikrointegration, see http://www.pb.izm.fhg.de/ee/070_services/75_toolbox/025_TPI_Rechner.html, accessed 2002-11-05.
21.
Ferro Electronic Materials, “Material Safety Data Sheet for Ultra Low Fire Temperature Co-fireable Ceramic Tape,” see http://www.ferro.com, accessed 2002-11-05.
22.
Pecht, M., 1999, Electronic Packaging-Materials and Their Properties, CRC Press, Boca Raton, London, New York, Washington, D. C., pp. 36.
23.
Devlin, L., Pearson, G., Pittcock, G., and Hunt, B., “RF and Microwave Component Development in LTCC,” see http://www.plextek.co.uk/pages/download/imapsns.pdf, accessed 2002-11-05. p. 3.
24.
Ecobilan, 2001, Eco-profile of High Commodity Phtalate Esters (DEHP/DINP/DIDP), Pricewaterhouse Coopers, Paris, p. 28.
25.
Injectorall Electronics, “Material Safety Data Sheet for FR4,” see http://www.injectorall.com/MSDSFR4.htm, accessed 2002-11-05.
26.
Association of Plastics Manufacturers Europe, “LCA-reports, Liquid Epoxy Resins-Data Summary,” http://www.apme.org/dashboard/business_layer/template.asp?url=http://www.apme.org/media/public_documents/20010820_ 170427/results_09.htm&title=Liquid+epoxy+resins, accessed 2002-11-05.
27.
Vill, V., 1998, “LiqCryst Database of Liquid Crystalline Compounds,” http://liqcryst.chemie.uni-hamburg.de/lc/lc_53887.htm, accessed 2002-10-01.
28.
Karlsson, S., and Albertsson, A-C., 1995, “Polymerteknologi m.k. 3E1100 fo¨r K3 1994/95,” Technique Report, p. 179.
29.
Energimyndigheten, 2000, “Miljo¨aspekter pa˚ materialval till bra¨nsleceller” (in Swedish). Elforsk AB, Stockholm Bra¨nsleceller-3/00, Elforsk projekt 2140, pp. 10.
30.
Port, N., 2000, “Foundations of EcoLab,” see http://www.port.se/ecolab/default.htm, accessed 2002-10-23.
31.
Goedkoop, M., et al. 2000, “The Eco-indicator 99: A Damage Oriented Method for Life Cycle Impact Assessment, Manual for Designers,” see http://www.pre.nl, accessed 2002-10-01, p. 4.
32.
Karush, W., 1962, “Matematisk uppslagsbok (in Swedish),” Wahlstro¨m & Widstrand, Stockholm, Technique Report, p. 205.
33.
Yang, R., and Hayden, T. F., 2003, “Recent Advancements in Flex Circuit Technology using Liquid Crystal Polymer Substrates,” Foldable Flex and Thinned Silicon Multichip Packaging Technology, Chapter 11, John Balde, ed. (in press).
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