Finite element analysis was used to model the transient heat transfer problem and the mechanical influence of the conducting particle in the anisotropic conductive adhesive (ACF). Three-dimensional (3D) brick element was performed for the transient heat transfer analysis, and the result was found that heat was transferred and spread from the die to the ACF and its conducting particle very quickly; in around 0.5 sec the ACF can reach the bonding temperature of 220°C. For the mechanical stress analysis of the conducting particle, the degree of the deformation was increased as the bonding force increased. The conducting particle was subjected to the larger stress level as the smaller of the particle size. The stress concentration was located at the edge area and diminished at the center area. It was also found that the cracks were found at the four corners of the conducting particles which was due to the highest stress level subjected on that location. Moreover, if only considering the plastic particle, the stress level was concentrated at the center area and vanished at the edge area.

Issue Section:
Technical Briefs
Keywords:
flip-chip devices, integrated circuit bonding, integrated circuit packaging, adhesives, conducting polymers, particle size, finite element analysis, heat transfer, stress analysis, thermal stress cracking, temperature distribution, plastic packaging
Topics:
Bonding, Particulate matter, Deformation, Finite element analysis, Stress, Particle size
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