This research is aimed at investigating by experimental means a possible use of the Vapotron Effect for the cooling of electronic devices. The problem deals with a particular kind of subcooled boiling which is able to enhance heat exchange between a non-isothermal finned surface, simulating the packaging of an electronic component, and a refrigerant fluid (water in the case here presented) flowing on it. The experimental set up is first described in detail then employed to perform a number of tests aiming at a full characterization of the pulsatile nature of the phenomenon; the average heat transfer coefficient for the Vapotron Effect in a state of forced convection has been experimentally determined. The experimental tests have shown the existence of a relation that couples temperature trend of water in the cavities between the fins and cycle of events characterising the phenomenon. These results will be applied in the future to the study of more dynamic phenomena. A comparative analysis concerning the thermal performances of the Vapotron Effect concludes the paper.

Issue Section:
Technical Papers
Keywords:
cooling, forced convection, thermal management (packaging), boiling
Topics:
Boiling, Cavities, Cooling, Electronic equipment, Fluids, Forced convection, Heat transfer coefficients, Heating, Refrigerants, Temperature, Water, Fins, Subcooling, Heat, Packaging, Flow (Dynamics), Electronic components
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