The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young’s moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking, and fatigue of solder interconnects. This paper intends to investigate mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents. Both numerical and experimental investigations provide the basis for understanding and evaluating failure mechanisms especially in solder joints, as well as several polymer material interfaces, and should support further applications for raising the thermo-mechanical reliability of advanced electronic packages.

Issue Section:
Technical Papers
Keywords:
plastic packaging, integrated circuit packaging, fracture mechanics, integrated circuit reliability, failure analysis, delamination, thermal stress cracking, finite element analysis, fracture toughness
Topics:
Delamination, Finite element analysis, Fracture (Materials), Fracture mechanics, Stress, Fracture toughness, Reliability, Fracture (Process), Integrated circuits, Risk assessment
1.
Auersperg, J., Vogel, D., Simon, J., Schubert, A., and Michel, B., 1997, “Reliability Evaluation of Chip Scale Packages by FEA and microDAC,” Proc. Symp. on Design and Reliability of Solders and Solder Interconnects held during the TMS Annual Meeting, Orlando, Feb. 9–13, pp. 439–445.
2.
Auersperg, J., Schubert, A., Vogel, D., Michel, B., and Reichl, H., 1997, “Fracture and Damage Evaluation in Chip Scale Packages and Flip Chip Assemblies by FEA and MicroDAC,” Symp. on Application of Fracture Mechanics in Microelectronic Packaging, Dallas, Nov. 16–21, Dallas, USA, AMD-Vol. 222/EEP-Vol. 20, pp. 133–138.
3.
Schubert, A., Dudek, R., Michel, B., and Reichl, H., 1997, “Materials Mechanics and Mechanical Reliability of Flip Chip Assemblies on Organic Substrates,” Proc. 3rd int. Symp. and Exhib. on Advanced Packaging Materials, Braselton, Georgia, Mar. 9–12, pp. 106–109.
4.
Auersperg, J., Winkler, T., Vogel, D., and Michel, B., 1998, “Damage and Fracture Evaluation in Micro-electronic Assemblies by FEA and Experimental Investigations,” 2nd 1998 IEMT/IMC Symp. Tokyo, Japan, April 15–17, Proc. pp. 290–295.
5.
Dudek
,
R.
,
Scherzer
,
M.
,
Schubert
,
A.
, and
Michel
,
B.
,
1998
, “
FE-Simulation for Polymeric Packaging Materials
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
21
(
2
) June, pp.
301
–
309
.
6.
Saitoh
,
T.
,
Matsuyama
,
H.
, and
Hoya
,
M.
,
1998
, “
Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading — Part III: Material Properties and Package Geometry
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part B
21
(
4
) Nov., pp.
407
–
412
.
7.
Liu
,
Sh.
,
Mei
,
Y.
, and
Wu
,
T. Y.
,
1995
, “
Bimaterial Interfacial Crack Growth as a Function of Mode-Mixity
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
18
(
3
) Sept., pp.
618
–
626
.
8.
Wang
,
J.
,
Lu
,
M.
,
Ren
,
W.
,
Zou
,
D.
, and
Liu
,
Sh.
,
1999
, “
A Study of the Mixed-Mode Interfacial Fracture Toughness of Adhesive Joints Using a Multiaxial Fatigue Tester
,”
IEEE Transactions of Electronics Packaging Manufacturing
22
(
2
) April, pp.
166
–
173
.
9.
Wang
,
J.
,
Lu
,
M.
,
Zou
,
D.
, and
Liu
,
Sh.
,
1998
, “
Investigation of intefacial Fracture Behavior of a Flip-Chip Package under a Constant Concentrated Load
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part B
21
(
1
) Feb., pp.
79
–
86
.
10.
Michel, B., Will, P., Auersperg, J., and Winkler, T., 1990, “Integral Concepts of Fracture Mechanics — Deterministic and Probabilistic Approach,” Fracture Mechanics Applications in Lifetime Estimation of Power Plant Components, S. Sedmak, ed., EMAS London, 1990, pp. 1–15.
11.
Auersperg, J., and Michel, B., 1998, “Fracture and Damage Evaluation in Microelectronic Assemblies by FEA,” 9th Int. Conf. on Modern Materials & Technologies, CIMTEC ’98, Florence, Italy, 14th–19th June, Proc. Symp. 1–Comp. Modeling and Simulation of Materials, pp. 403–410.
12.
Brust
,
F. W.
, and
Atluri
,
S. N.
,
1986
, “
Studies on Creep Crack Growth using the T*-Integral
,”
Eng. Fract. Mech.
23
, pp.
551
–
574
.
13.
Brust
,
F. W.
,
Nishioka
,
T.
,
Atluri
,
S. N.
, and
Nakagaki
,
M.
,
1986
, “
Further Studies on Elastic-Plastic Stable Fracture Utilizing the T*-Integral
,”
Eng. Fract. Mech.
23
(
3
), pp.
551
–
574
.
14.
Sun
,
C. T.
, and
Qian
,
W.
,
1997
, “
The Use of Finite Extension Strain Energy Release Rates in Fracture of Interfacial Cracks
,”
Int. J. Solids Struct.
34
(
20
), pp.
2595
–
2609
.
15.
Hutchinson
,
J. W.
,
Mear
,
M.
, and
Rice
,
J. R.
,
1987
, “
Crack Paralleling an Interface Between Dissimilar Materials
,”
J. Applied Mechanics
54
, pp.
828
–
832
.
16.
Hutchinson
,
J. W.
,
1990
, “
Mixed Mode Fracture Mechanics of Interfaces, Metal-Ceramic Interface
,”
Acta Scripta Metallurgica
4
, pp.
295
–
306
.
17.
Rybicki
,
E. F.
, and
Kanninen
,
M. F.
,
1997
, “
A Finite Element Calculation of Stress Intensity Factors by a Modified Crack Closure Integral
,”
Eng. Fract. Mech.
9
, pp.
931
–
938
.
18.
Hutchinson
,
J. W.
, and
Suo
,
Z.
,
1992
, “
Mixed Mode Cracking in Layered Materials
,”
Adv. Appl. Mech.
29
, pp.
63
–
191
.
19.
Vogel, D., Auersperg, J., Schubert, A., Michel, B., and Reichl, H., 1997, “Deformation Analysis on Flip Chip Solder Interconnects by microDAC,” Proc. of Reliability of Solders and Solder Joints Symposium at 126th TMS Annual Meeting & Exhibition, Feb. 9–13, Orlando, USA, Design & Reliability of Solders and Solder Interconnects, R. K. Mahidhara, ed., TMS Publication Cat. No. 96-80433, pp. 429–438.
20.
Sundaraman
,
V.
, and
Sitaraman
,
S. K.
,
1999
, “
Determination of Fracture Toughness for Metal/Polymer Interfaces
,”
ASME J. Electron. Packag.
121
, pp.
275
–
281
.
21.
Charalambides
,
P. G.
,
Lund
,
J.
,
Evans
,
A. G.
, and
McMeeking
,
R. M.
,
1989
, “
A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces
,”
ASME J. Appl. Mech.
56
, pp.
77
–
82
.
22.
Pearson, R. A., Lloyd, T. B., and Bagheri, R., 1997, “Adhesion issues at Epoxy Underfill/Solder Mask Interfaces,” J. of SMT, Apr. pp. 31–36.
23.
Auersperg, J., Badrighavifekr, H., Kieselstein, E., Winkler, T., Schubert, A., and Michel, B., 1999, “Fracture and Damage Investigations Enhancing the Thermo-Mechanical Reliability of Plastic Packages,” Poly ’99: Mechanics, Physics & Reliability of Polymeric Materials for Microelectronics and Photonics Applications, Paris, France, Dec. 12–15, EEP-Vol. 27, pp. 19–25.
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