In this paper, flow during the filling and post-filling stages in semiconductor chip encapsulation has been analyzed. A finite-element method based on the Hele-Shaw approximation is used for the flow analysis in the chip cavity. The compressibility of the epoxy-molding compound has been considered to analyze the post-filling stage. The model has been verified by comparing resulting predictions with experimental results. Specifically, pressure has been measured in a rectangular cavity and compared with simulation results. The calculated and experimental results show good agreement. [S1043-7398(00)00101-8]
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