The method of digital speckle correlation is introduced, and so is the hardware system to implement the method. The advantages and the features of the technique are discussed, and application examples are given. Owing to the high spatial resolution that this technique can achieve, the method is especially useful in measuring small areas of an object, or a small component in an assembly, whether the surfaces under probing are planar or not. The applications have proved that the technique is a promising tool for the reliability study of microelectronic packages.

Issue Section:
Technical Papers
Topics:
Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement
1.
Bruck, H. A., Mcneill, S. R., Sutton, M. A., and Peters III, W. H., 1989, “Digital Image Correlation Using Newton-Raphson Method of Partial Differential Correlation,” Experimental Mechanics, Sept., pp. 261–267.
2.
Guo
Y.
, and
Li
L.
,
1996
, “
Hybrid Method for Local Strain Determinations in PBGA Solder Joints
,”
Experimental/Numerical Mechanics in Electronic Packaging
, Vol.
1
, B. Han, D. Barker, and R. Mahajan, eds., pp.
22
–
30
.
3.
Lyons, J. S., Liu, J., and Sutton, M. A., 1989, “High Temperature Deformation Measurements Using Digital-Image Correlation,” Experimental Mechanics, March, pp. 64–70.
4.
Zou, D., He, X., Liu, S., Guo, Y., and Dai, F., 1997, “Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moire´ Interferometry,” Applications of Experimental Mechanics to Electronic Packaging — 1997, EEP-Vol. 22 AMD-Vol. 226, ASME, NY, pp. 69–76.
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 by The American Society of Mechanical Engineers
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