The power densities and heat generation in microelectronic systems have increased dramatically as individual electronic components have been miniaturized. As a result of the growing number of thermally-induced failures in these systems, their thermal performance has become the focus of increasing concern. The use of thermally conducting interstitial coatings within and between electronic components has proven to be one technique suitable for thermal enhancement. This review will address both metallic and nonmetallic coatings suitable for thermal enhancement and discuss some of the major areas of application.
Issue Section:
Technical Papers
1.
Antonetti
V. W.
Yovanovich
M. M.
1985
, “Enhancement of Thermal Contact Conductance by Metallic Coatings: Theory and Experiment
,” ASME Journal of Heat Transfer
, Vol. 107
, pp. 513
–519
.2.
Bar-Cohen
A.
Kraus
A.
1981
, “Thermal Consideration in the Packaging of Electrical and Electronic Components
,” ASME HTD
, Vol. 20
, pp. 1
–10
.3.
Blanchard, D. G., Marotta, E. E., and Fletcher, L. S., 1992, “A Survey of the Thermal Conductivity of Synthetic and Natural Diamond Materials,” AIAA Paper 92-0708, 30th, Aerospace Sciences Meeting and Exhibit, Reno, Nevada, January 6–9.
4.
Chung, K. C., Sheffield, J. W., and Sauer, H. J., Jr., 1990, “Effects of Metallic Coated Surfaces on Thermal Contact Conductance: An Experimental Study,” Proceedings of the 6th Miami Int. Symp. On Heat and Mass Transfer, Univ. of Miami, Miami, FL.
5.
Chung, K. C., Sheffield, J. W., Sauer, H. J., Jr. and O’Keefe, T. J., 1991, “The Effects of Transitional Buffering Interface Coatings on Thermal Contact Conductance,” AIAA Paper 91-0490, The American Institute for Aeronautics and Astronautics, Reston, VA.
6.
Darrow, G. R., 1965, “Engineering the Sulfuric Acid Process,” Anodized Aluminum, ASTM STP 388, American Society for Testing and Materials, Philadelphia, PA, pp. 62–84.
7.
Fletcher
L. S.
1988
, “Recent Developments in Contact Conductance Heat Transfer
,” ASME Journal of Heat Transfer
, Vol. 110
, No. 4B
, pp. 1059
–1070
.8.
Fletcher
L. S.
1990
, “A Review of Thermal Enhancement Techniques for Electronic Systems
,” IEEE Transactions an Components, Hybrids, and Manufacturing Technology
, Vol. 13
, No. 4
, pp. 1012
–1021
.9.
Fletcher, L. S., Lambert, M. A., and Marotta, E. E., 1992, “Thermal Enhancement Techniques for SEM Guide Ribs and Card Rails, 1992 Annual Report,” CHTL-6770-14, Department of Mechanical Engineering. Texas A&M University, College Station, TX.
10.
Fletcher, L. S., Lambert, M. A., Marotta, E. E., and Adams, J. S., 1993, “Thermal Enhancement Techniques for SEM Guide Ribs and Card Rails,” Proc. Nat. Electronic Packaging and Production Conf.—West (NEPCON), Anaheim, CA, pp. 1655–1664.
11.
Flinn, R. A., and Trojan, P. K., 1981, Engineering Materials and Their Applications, 2nd ed., Houghton Miflin Co., Boston, MA.
12.
Fried, E., 1965, “Study of Interface Thermal Contact Conductance,” summary report, G. E. Document 65504395, G. E. Valley Forge Space Technology Center, Philadelphia, PA.
13.
Kang
T. K.
Peterson
G. P.
Fletcher
L. S.
1990
, “Enhancing the Thermal Contact Conductance Through the Use of Thin Metallic Coatings
,” ASME Journal of Heat Transfer
, Vol. 112
, pp. 864
–871
.14.
Kline
S. J.
McClintock
F. A.
1953
, “Describing Uncertainties in Single Sample Experiments
,” Mechanical Engineering
, Vol. 65
, pp. 37
–43
.15.
Kraus, A. D., Chu, R. C., and Bar-Cohen, A., 1982, “Thermal Management of Microelectronics: Past, Present and Future,” Comput. Mech. Eng., pp. 69–70.
16.
Krieg, A., 1959, “Processing Procedures,” Proc. Symposium Electroless Nickel Plating, ASTM STP 265, American Society for Testing and Materials, Philadelphia, PA, pp. 21–37.
17.
Lambert
M. A.
Fletcher
L. S.
1993
, “A Review of the Thermal Contact Conductance of Junctions with Metallic Coatings and Films
,” AIAA Journal of Thermophysies and Heat Transfer
, Vol. 7
, No. 4
, pp. 547
–554
.18.
Lambert
M. A.
Fletcher
L. S.
1994
, “Metallic Coatings for Enhancement of Thermal Contact Conductance
,” AIAA Journal of Thermophysics and Heat Transfer
, Vol. 8
, No. 2
, pp. 341
–348
.19.
Lambert
M. A.
Fletcher
L. S.
1995
, “Experimental Investigation of the Thermal Contact Conductance of Electroplated Silver Coatings
,” AIAA Journal of Thermophysics and Heat Transfer
, Vol. 9
, No. 1
, pp. 79
–87
.20.
Lambert, M. A., and Fletcher, L. S., 1996, “Thermal Contact Conductance of Rough, Spherical Metals,” HTD-Vol. 327, ASME Proceedings of the 31st National Heat Transfer Conference, Vol. 5, pp. 169–175. ASME, NY, Houston.
21.
Maclean
J. D.
Karten
S. M.
1954
, “A Practical Application of Electroless Nickel Plating
,” Plating
, Vol. 41
, No. 11
, p. 1284
1284
.22.
Mahalingham
M.
Berg
N. M.
1984
, “Thermal Trends in Component Level Packaging
,” Int. J. Hybrid Microelectron
, Vol. 7
, No. 3
, pp. 1
–9
.23.
Mal’kov
V. A.
Dobashin
P. A.
1969
, “The Effect of Soft-Metal Coatings and Linings on Contact Thermal Resistance
,” Inzhenerno-Fizicheshii Zhurnal
, Vol. 17
, pp. 871
–879
.24.
Marotta
E. E.
Blanchard
D. G.
Fletcher
L. S.
1996
, “The Thermal Contact Conductance of Diamond-Like Films
,” AIAA Journal of Thermophysies and Heat Transfer
, Vol. 10
, No. 1
, pp. 19
–25
.25.
Marotta
E. E.
Lambert
M. A.
Fletcher
L. S.
1994
, “A Review of the Thermal Contact Conductance of Non-Metallic Coatings and Films
,” AIAA Journal of Thermophysics and Heat Transfer
, Vol. 8
, No. 2
, pp. 349
–357
.26.
Mayer, A. H., 1983, “Heat Transfer in the Service of the Integrated Microelectronic Revolution,” Proc. 1983 ASME Winter Ann. Meeting, Vol. 28, ASME, NY, pp. 1–4.
27.
Metals Handbook, Vol. 1, 1990, Properties and Selection: Nonferrous Alloys and Special-Purpose Materials, 10th ed., American Society of Metals. Metals Park, OH.
28.
Mikic, B. B., and Carnasciali, G., 1969, “The Effect of Thermal Conductivity of Plating Material on Thermal Contact Resistance,” ASME Paper 69-WA/HT-9.
29.
Moran, K., and Oktay, S., 1982, “Cooling Concepts for IBM Electronic Packages,” Proc. Second Ann. Int. Electronic Packaging Soc. (IEPS) Conf., pp. 120–140.
30.
O’Callaghan, P. W., Snaith, B., Probert, S. S., and Al-Astrabadi, F. R., 1981, “Prediction of Optimal Interfacial Filler Thickness for Minimum Thermal Contact Resistance,” AIAA Paper 81-1166.
31.
Peterson
G. P.
Fletcher
L. S.
1990
, “Measurement of the Thermal Contact Conductance and Thermal Conductivity of Anodized Aluminum Coatings
,” ASME Journal of Heat Transfer
, Vol. 112
, No. 3
, pp. 579
–585
.32.
Peterson, G. P., and Ortega, A., 1990, “Thermal Control of Electronic Equipment and Devices,” Advances in Heat Transfer, Pergammon, Oxford, U.K., pp. 181–279.
33.
Roddiger, H. A., and Mosby, T. D., 1989, “Interstitial Materials for Low Thermal Resistance Joints in Avionic Equipment,” SAE International, Warrendale, PA, Paper 891441.
34.
Simons
R. E.
1983
, “Thermal Management of Electronic Equipment
,” Solid-State Technol.
, Vol. 26
, October, pp. 131
–137
.35.
Smith, W. F., 1981, “Structure and Properties of Engineering Alloys,” McGraw Hill, NY.
36.
Touloukian, Y. S., and Ho, C. Y., eds., 1972, Thermophysical Properties of Matter: Thermal Conductivity of Metallic Solids, Vol. 1, Plenum Press, NY.
37.
Touloukian, Y. S., and Ho, C. Y., eds., 1976, Thermophysical Properties of Selected Aerospace Materials, Part II: Thermophysical Properties of Seven Materials, Thermophysical and Electronic Properties Information Analysis Center, Purdue University, West Lafayette, IN.
38.
Yip, F. C., 1974, “Effect of Oxide Films on Thermal Contact Resistance,” AIAA Paper 74-693.
39.
Yovanovich, M. M., 1987, “Theory and Applications of Constriction and Spreading Resistance Concepts for Microelectronic Thermal Management,” Proc. Int. Symp. On Cooling Techniques for Electronic Equipment, Honolulu, Hawaii.
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