The finite element procedure with the unified disturbed state modeling concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 eutectic solder alloy. This solder alloy is a commonly used interconnection material for surface mount technology packages. It is demonstrated that the proposed procedure provides highly satisfactory correlation with the observed laboratory behavior of materials and with test results for a chip-substrate system simulated in the laboratory.
Issue Section:
Technical Papers
1.
Basaran
C.
Desai
C. S.
Kundu
T.
1998
, “Thermomechanical Finite Element Analysis Using the Disturbed State Concept Part 1: Theory and Formulation
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 120
, No. 1
, pp. 41
–47
.2.
Chia, J., and Desai, C. S., 1994, Constitutive Modeling of Thermomechanical Response of Materials in Semiconductor Devices with Emphasis on Interface Behavior, report to the National Science Foundation, Department of Civil Engineering and Engineering Mechanics, University of Arizona, Tucson, AZ.
3.
Clech, J.-P., and Augis, J. A., 1987, “Engineering Analysis of Thermal Cycling Accelerated Test for Surface-Mount Attachment Reliability Evaluation,” Proc. of the VII Annual Electronic Packaging Conf., Boston MA, Vol. 1, pp. 385–411.
4.
Desai
C. S.
Basaran
C.
Zhang
W.
1997
, “Numerical Algorithms and Mesh Dependence in the Disturbed State Concept
,” Int. J. Num. Meth. Eng.
, Vol. 40
, pp. 3059
–3083
.5.
Desai
C. S.
Chia
J.
Kundu
T.
Prince
J.
1997
, “Thermomechanical Response of Materials and Interfaces in Electronic Packaging Part I: Unified Constitutive Models and Calibration
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 119
, No. 4
, pp. 294
–300
.6.
Frear, D. R., Morgan, H., Burchett, S., and Lau, J., 1994, The Mechanics of Solder Alloy Interconnections, Van Nostrand Reinhold, New York, NY.
7.
Guo
Q.
Cutiongco
E. C.
Keer
L. M.
Fine
M. E.
1992
, “Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, pp. 145
–151
.8.
Hall
P.
1984
, “Forces, Moments and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards
,” IEEE Trans. Comp. Hybrids Manuf Tech.
, Vol. 7
, No. 4
, pp. 314
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.9.
Hall, P. M., and Sherry, W. M., 1986, “Materials, Structures and Mechanics of Solder-Joints for Surface-Mount Microelectronics Technology,” Proc. of the Lectures of the 3rd International Conference on Techniques de Connexion en Electronique, Welding Society, Fellbach, Dusseldorf, Germany.
10.
Harper, C. A., 1970, Handbook of Materials and Processes for Electronics, McGraw-Hill, NY, pp. 9–71.
11.
Nir
N.
Dudderar
T. D.
Wong
C. C.
Storm
A. R.
Fatigue Properties of Microelectronics Solder Joints
,” ASME JOURNAL OF ELECTRONICS PACKAGING
, Vol. 113
, No. 2
, pp. 92
–101
.12.
Pao, Y. H., Chen, K. L., and Kuo, A. Y., 1991, “A Nonlinear and Time Dependent Finite Element Analysis of Solder Joints in Surface Mounted Components Under Thermal Cycling,” Mat. Res. Soc. Symp. Proc., Vol. 225.
13.
Riemer, E. D., 1990, “Prediction of Temperature Cycling Life for SMT Solder Joints on TCE-Mismatched Substrates,” Proc. Electronic Components, IEEE, Piscataway, NJ, pp. 418–423.
14.
Skipor, A., Harren, S., and Botsis, J., 1992, “Constitutive Characterization of 63/37 Sn/Pb Eutectic Solder Using the Bodner-Partom Unified Creep-Plasticity Model,” Advances in Electronic Packaging, Proc. of the Joint ASME/JSME Conf. on Electronic Packaging, W. T. Chen, and H. Abe, eds., Vol. 2, pp. 661–672.
15.
Solomon, H. D., 1989, “Low Cycle Fatigue of 60/40 Solder Plastic Strain Limited vs. Displacement Limited Testing,” Electronic Packaging: Materials and Processes, pp. 29–47.
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