Failures in electronic packaging under thermal fatigue often result from cracking in solder joints due to creep/fatigue crack growth. A nonlinear, time-dependent finite element analysis was performed to study the effect of critical design parameters on thermal reliability of leadless chip capacitor or resistor solder joints. The shear strain range based on thermal hysteresis response was used to study the sensitivity of various parameters, such as solder stand-off height, fillet geometry, Cu-pad length, and component length and thickness. The results were used as guidelines for designing reliable solder joints. In addition, an analytical model for the solder joint assembly was derived. It can be used .as an engineering approach for rapid assessment of large numbers of design parameters. The accuracy and effectiveness of the analytical model were evaluated by comparing with finite element results.
Skip Nav Destination
Article navigation
June 1995
Technical Papers
Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints
Edward Jih,
Edward Jih
Research Laboratory, MD 2313, Ford Motor Company, Dearborn, MI 48121-2053
Search for other works by this author on:
Yi-Hsin Pao
Yi-Hsin Pao
Research Laboratory, MD 2313, Ford Motor Company, Dearborn, MI 48121-2053
Search for other works by this author on:
Edward Jih
Research Laboratory, MD 2313, Ford Motor Company, Dearborn, MI 48121-2053
Yi-Hsin Pao
Research Laboratory, MD 2313, Ford Motor Company, Dearborn, MI 48121-2053
J. Electron. Packag. Jun 1995, 117(2): 94-99 (6 pages)
Published Online: June 1, 1995
Article history
Received:
August 1, 1994
Revised:
March 31, 1995
Online:
November 6, 2007
Citation
Jih, E., and Pao, Y. (June 1, 1995). "Evaluation of Design Parameters for Leadless Chip Resistors Solder Joints." ASME. J. Electron. Packag. June 1995; 117(2): 94–99. https://doi.org/10.1115/1.2792087
Download citation file:
Get Email Alerts
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
Related Articles
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
J. Electron. Packag (March,2008)
Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
J. Electron. Packag (September,2003)
Crack Propagation in Solder Joints During Thermal-Mechanical Cycling
J. Electron. Packag (June,1994)
Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis
J. Electron. Packag (December,2000)
Related Proceedings Papers
Related Chapters
Understanding the Problem
Design and Application of the Worm Gear
Memristor: Bryond Moore's Law and Digital Computing
International Conference on Computer and Electrical Engineering 4th (ICCEE 2011)
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies