Functionally graded materials (FGM) have recently attracted a lot of research attention in the wake of the recent prominence of additive manufacturing (AM) technologies. The continuously varying spatial composition profile of two or more materials affords FGM to possess properties of multiple different materials simultaneously. Emerging AM technologies enable manufacturing complex shapes with customized multifunctional material properties in an additive fashion. In this paper, we focus on providing an overview of research at the intersection of AM techniques and FGM objects. We specifically discuss FGM modeling representation schemes and outline a classification system to classify existing FGM representation methods. We also highlight the key aspects such as the part orientation, slicing, and path planning processes that are essential for fabricating FGM object through the use of multimaterial AM techniques.
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December 2018
Research-Article
Additive Manufacturing of Functionally Graded Material Objects: A Review
Binbin Zhang,
Binbin Zhang
Manufacturing and Design (MAD) Lab,
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall,
Buffalo, NY 14260
e-mail: bzhang25@buffalo.edu
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall,
Buffalo, NY 14260
e-mail: bzhang25@buffalo.edu
Search for other works by this author on:
Prakhar Jaiswal,
Prakhar Jaiswal
Manufacturing and Design (MAD) Lab,
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
Buffalo, NY 14260
e-mail: prakharj@buffalo.edu
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall
,Buffalo, NY 14260
e-mail: prakharj@buffalo.edu
Search for other works by this author on:
Rahul Rai,
Rahul Rai
Manufacturing and Design (MAD) Lab,
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
Buffalo, NY 14260
e-mail: rahulrai@buffalo.edu
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall
,Buffalo, NY 14260
e-mail: rahulrai@buffalo.edu
Search for other works by this author on:
Saigopal Nelaturi
Saigopal Nelaturi
Palo Alto Research Center,
Palo Alto, CA 94304
e-mail: saigopal.nelaturi@parc.com
3333 Coyote Hill Road
,Palo Alto, CA 94304
e-mail: saigopal.nelaturi@parc.com
Search for other works by this author on:
Binbin Zhang
Manufacturing and Design (MAD) Lab,
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall,
Buffalo, NY 14260
e-mail: bzhang25@buffalo.edu
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall,
Buffalo, NY 14260
e-mail: bzhang25@buffalo.edu
Prakhar Jaiswal
Manufacturing and Design (MAD) Lab,
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
Buffalo, NY 14260
e-mail: prakharj@buffalo.edu
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall
,Buffalo, NY 14260
e-mail: prakharj@buffalo.edu
Rahul Rai
Manufacturing and Design (MAD) Lab,
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
Buffalo, NY 14260
e-mail: rahulrai@buffalo.edu
Department of Mechanical and
Aersopace Engineering,
University at Buffalo (UB)-SUNY,
318 Jarvis Hall
,Buffalo, NY 14260
e-mail: rahulrai@buffalo.edu
Saigopal Nelaturi
Palo Alto Research Center,
Palo Alto, CA 94304
e-mail: saigopal.nelaturi@parc.com
3333 Coyote Hill Road
,Palo Alto, CA 94304
e-mail: saigopal.nelaturi@parc.com
1Corresponding author.
Manuscript received August 20, 2017; final manuscript received March 15, 2018; published online July 3, 2018. Assoc. Editor: Yong Chen.
J. Comput. Inf. Sci. Eng. Dec 2018, 18(4): 041002 (16 pages)
Published Online: July 3, 2018
Article history
Received:
August 20, 2017
Revised:
March 15, 2018
Citation
Zhang, B., Jaiswal, P., Rai, R., and Nelaturi, S. (July 3, 2018). "Additive Manufacturing of Functionally Graded Material Objects: A Review." ASME. J. Comput. Inf. Sci. Eng. December 2018; 18(4): 041002. https://doi.org/10.1115/1.4039683
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