In our previous paper [1], four material constants required for Low-Cycle Fatigue under drop impact modeling in ABAQUS were obtained. This study aimed to validate that technique using conventional JEDEC drop test results. Several test boards were subjected to drop test at 3000G/0.28ms, close to the most severe condition of JEDEC Standard. During repetitive drops, the overall electrical resistance of daisy-chained solder joints of each package on the test board was monitored to detect the failure. Weibull distribution were obtained for edge and center package. The numerical model was then built in ABAQUS Low-cycle Fatigue, the set of constant obtained from previous study [1] was used as a reference source for the model. Fatigue life of the package extracted from the numerical model was compared with experiment results. The validation was finally reported.

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